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IC chip detecting loading tool

A technology of chip detection and tooling, which is applied in the field of IC chip detection and loading tooling, can solve the problems of low feeding efficiency, small application area of ​​feeding tooling, and large manual participation, so as to improve the efficiency of push, ensure stability, The effect of ensuring accuracy

Active Publication Date: 2021-12-21
四川明泰微电子科技股份有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] When the existing IC chip is loaded, the opening end of the packaging box is manually inserted into the feeding port of the IC chip detection, and then the chip is detected through the automatic feeding detection method, and this method has a large degree of manual participation and at the same time It often occurs that the detection instrument runs in neutral, which reduces the efficiency and automation of IC chip detection
[0005] There is also an existing automatic loading method, which can only be used for IC chip loading with a certain size and structure, and the size and structure of IC chips are also quite different, so the existing loading tooling has a relatively large application area. At the same time, the existing feeding method usually adopts the screw drive method for reciprocating feeding. This transmission method is convenient to control but the feeding efficiency is low, and the existing feeding tool is inconvenient for packaging when pouring out chips. The overturning of the box and the positioning during the overturning, so that the packaging box often falls during the overturning process

Method used

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Embodiment Construction

[0035] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments It is a part of embodiments of the present invention, but not all embodiments. The components of the embodiments of the invention generally described and illustrated in the figures herein may be arranged and designed in a variety of different configurations.

[0036] Accordingly, the following detailed description of the embodiments of the invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely represents selected embodiments of the invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art wi...

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Abstract

The invention discloses an IC chip detecting loading tool, and belongs to the related technical field of semiconductor detection or material conveying. The tool comprises a placing assembly, a feeding assembly is arranged at one side of the placing assembly, and a pouring-out assembly is arranged at the other side of the placing assembly. When the IC chip detecting loading tool is used for IC chip detection, loading operation of an IC chip is facilitated, when IC chip loading is carried out, self-adaptive adjustment can be carried out according to the specific structure of a packaging box, then the loading accuracy of the packaging box is ensured, meanwhile, stable discharging can be carried out, the packaging box is pushed in a reciprocating motion manner, the packaging box pushing efficiency is improved, the packaging box can be automatically overturned, pouring out of the IC chip in the packaging box is achieved, meanwhile, when the IC chip is poured out, one end of the packaging box can be limited, so that the stability of the packaging box during overturning is ensured, and higher practicability is achieved.

Description

technical field [0001] The invention relates to the related technical field of semiconductor detection or material transportation, in particular to an IC chip detection and feeding tooling. Background technique [0002] IC chip test is generally divided into physical appearance test, IC chip function test, chemical corrosion test, solderability test, DC parameter test, internal connection test without damage, environmental standard test for radioactive substances and failure analysis verification test. [0003] Generally, after the packaging of IC chips is completed, in order to facilitate transportation and transfer, they are often packed in a strip-shaped packaging box. One end of the packaging box is in a closed state, while the other end is in an open state. After completion, one end is often blocked by the box cover, and this packaging method is also convenient for testing and loading of IC chips. [0004] When the existing IC chip is loaded, the opening end of the pac...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B65G47/74B65G47/82B65G65/23G01R31/28G01R1/02
CPCB65G47/74B65G47/82B65G65/23G01R31/28G01R1/02B65G2201/025
Inventor 李蛇宏伍智勇
Owner 四川明泰微电子科技股份有限公司
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