Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Preparation method of film bulk acoustic resonator with electrodes provided with double-ring and bridge-shaped structures

A thin-film bulk acoustic wave, double-ring technology, applied in electrical components, impedance networks, etc., can solve the problem of further breakthroughs in thin-film bulk acoustic wave resonators, etc., to improve the frequency and Q value, the electromechanical coupling coefficient does not change much, and improve the Q effect of value

Pending Publication Date: 2021-12-24
HANGZHOU DIANZI UNIV
View PDF7 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] The electrode structure of the thin film bulk acoustic resonator has an important influence on the frequency and Q value of the thin film bulk acoustic resonator. The existing electrode structure design is often only carried out on the upper and lower surfaces of the electrode, and it has been difficult to further break through the thin film body with higher frequency and Q value. Acoustic Resonator Design
Moreover, most of the existing electrode structure designs are only carried out on the surface of the upper electrode, ignoring the influence of the lower electrode structure design on the frequency and Q value of the thin film bulk acoustic resonator

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Preparation method of film bulk acoustic resonator with electrodes provided with double-ring and bridge-shaped structures
  • Preparation method of film bulk acoustic resonator with electrodes provided with double-ring and bridge-shaped structures
  • Preparation method of film bulk acoustic resonator with electrodes provided with double-ring and bridge-shaped structures

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0039] The present invention will be further described below in conjunction with accompanying drawing.

[0040] A method for preparing a film bulk acoustic resonator with electrodes provided with a double ring and a bridge structure, the specific steps are as follows:

[0041] S1: if figure 1 As shown, the substrate 100 is ultrasonically washed; the peeling layer 114 is deposited on the surface of the substrate 100 by metal organic compound chemical vapor deposition (MOCVD); the material of the peeling layer 114 is GaN; The electrical layer 101 has a thickness of 10nm-4000nm. Next, metal is deposited on the surface of the piezoelectric layer 101 by thermal evaporation or magnetron sputtering, and patterned by plasma or wet etching to form the bottom electrode 102 . Finally, metal is deposited on the surface of the lower electrode 102 by thermal evaporation or magnetron sputtering, and patterned by plasma or wet etching to form the inner annular protrusion 104 and the outer a...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
thicknessaaaaaaaaaa
widthaaaaaaaaaa
thicknessaaaaaaaaaa
Login to View More

Abstract

The invention discloses a preparation method of a film bulk acoustic resonator with electrodes provided with double ring-shaped and bridge-shaped structures, and the method specifically comprises the following steps: sequentially depositing a stripping layer, a piezoelectric layer and a lower electrode on a substrate, and depositing an inner ring-shaped bulge, an outer ring-shaped bulge and a lower sacrificial layer wrapping the two bulges on the lower electrode, depositing a lower protection layer wrapping the lower sacrificial layer and a to-be-bonded layer II wrapping the lower protection layer on the piezoelectric layer; bonding the to-be-bonded layer I and the to-be-bonded layer II on the substrate, and removing the stripping layer and the substrate; depositing two long-strip-shaped upper sacrificial layers on the piezoelectric layer, depositing two bridge-type structures on the two long-strip-shaped upper sacrificial layers, depositing an upper electrode with the two sides connected with the two bridge-type structures respectively on the surface of the piezoelectric layer, and depositing an upper protection layer on the upper electrode and the two bridge-type structures; and forming a through hole in the piezoelectric layer, and removing the strip-shaped upper sacrificial layer and the strip-shaped lower sacrificial layer. The surface of the lower electrode of the resonator is provided with the inner annular protrusion and the outer annular protrusion, and the two side walls of the upper electrode are each provided with a bridge-type structure, so that the film bulk acoustic wave resonator has a higher Q value.

Description

technical field [0001] The invention relates to a thin-film bulk acoustic wave resonator, in particular to a method for preparing a thin-film bulk acoustic wave resonator whose electrodes are provided with double ring and bridge structures. Background technique [0002] The electrode structure of the thin film bulk acoustic resonator has an important influence on the frequency and Q value of the thin film bulk acoustic resonator. The existing electrode structure design is often only carried out on the upper and lower surfaces of the electrode, and it has been difficult to further break through the thin film body with higher frequency and Q value. Acoustic resonator design. Moreover, most of the existing electrode structure designs are only carried out on the surface of the upper electrode, ignoring the influence of the lower electrode structure design on the frequency and Q value of the thin film bulk acoustic resonator. It can be seen that if the structural design of the u...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H03H3/02H03H9/02
CPCH03H3/02H03H9/02015H03H9/02047H03H2003/023
Inventor 轩伟鹏张标石林豪董树荣金浩骆季奎李文钧孙玲玲
Owner HANGZHOU DIANZI UNIV
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products