Solar silicon wafer cutting method and device and storage medium
A technology of solar silicon wafers and cutting methods, applied in the direction of stone processing equipment, fine working devices, climate sustainability, etc.
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[0037] Reference will now be made in detail to the exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, the same numerals in different drawings refer to the same or similar elements unless otherwise indicated. The implementations described in the following exemplary examples do not represent all implementations consistent with the present disclosure. Rather, they are merely examples of apparatuses and methods consistent with aspects of the present disclosure as recited in the appended claims.
[0038] Before introducing the embodiments of the present disclosure, the technology related to the embodiments will be described first.
[0039] Silicon wafer multi-wire cutting technology is currently the most advanced silicon wafer processing technology in the world. Its principle is to use a high-speed moving steel wire to drive the cutting blade attached to the steel wire to rub ag...
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Abstract
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