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Copper target material and method for improving internal structure of copper target material

A technology of copper target and structure, applied in metal material coating process, ion implantation plating, coating, etc., can solve problems such as copper target blank defects, improve uniformity, improve coating quality, and refine internal grains effect of size

Pending Publication Date: 2021-12-31
KONFOONG MATERIALS INTERNATIONAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] In view of the problems existing in the prior art, the object of the present invention is to provide a copper target and a method for improving its internal structure. The method solves the problem of internal defects of the copper target blank by optimizing the preparation process of the copper target, so that The internal grains are sufficiently fine and uniform, which improves the quality and performance of the target

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0082] This embodiment provides a method for improving the internal structure of a copper target, the method comprising the following steps:

[0083] A copper target blank with a purity of 6N is provided; the initial diameter is 170mm, and the initial length is 340mm.

[0084] (1) One-time forging: Under the condition of 900°C, first upsetting and drawing (upsetting first, then drawing), the compression ratio of upsetting is 50%, and the elongation ratio of drawing is 205%, repeat 3 groups, then forge the copper target blank into a cube and cool it down;

[0085] (2) Primary heat treatment: the temperature is 300°C, the time is 30min, and then water cooling;

[0086] Secondary forging: Under the condition of 500°C, first perform upsetting and elongation (first upsetting, then elongation), the compression ratio of upsetting is 50%, and the elongation ratio of elongation is 200%, repeat 3 groups , and then forge the copper target blank into a cube;

[0087] Repeat step (2) 3 ...

Embodiment 2

[0095] This embodiment provides a method for improving the internal structure of a copper target, the method comprising the following steps:

[0096] A copper target blank with a purity of 6N is provided; the initial diameter is 180mm, and the initial length is 300mm.

[0097] (1) One-time forging: Under the condition of 900°C, upsetting and elongation (first elongation, then upsetting), the compression ratio of upsetting is 48%, the elongation ratio of elongation is 200%, repeat 3 groups, then forge the copper target blank into a cuboid and cool it down;

[0098] (2) Primary heat treatment: the temperature is 280°C, the time is 40min, and then water-cooled;

[0099] Secondary forging: Under the condition of 520°C, first perform upsetting and elongation (first upsetting, then elongation), the compression ratio of upsetting is 53%, and the elongation ratio of elongation is 210%, repeat 3 groups , and then forge the copper target blank into a cube;

[0100] Repeat step (2) 3 ...

Embodiment 3

[0108] This embodiment provides a method for improving the internal structure of a copper target, the method comprising the following steps:

[0109] A copper target blank with a purity of 6N is provided; the initial diameter is 180mm, and the initial length is 350mm.

[0110] (1) One-time forging: Under the condition of 890°C, first perform upsetting and elongation (upsetting first, then elongation), the compression ratio of upsetting is 55%, and the elongation ratio of elongation is 210%, repeat 3 groups, then forge the copper target blank into a cube and cool it down;

[0111] (2) Primary heat treatment: the temperature is 320°C, the time is 20min, and then water cooling;

[0112] Secondary forging: Under the condition of 480°C, first perform upsetting and elongation (first upsetting, then elongation), the compression ratio of upsetting is 48%, and the elongation ratio of elongation is 200%, repeat 3 groups , and then forge the copper target blank into a cube;

[0113] R...

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Abstract

The invention provides a copper target material and a method for improving the internal structure of the copper target material. The method comprises the following steps of providing a copper target blank; (1) cooling after primary forging; (2) carrying out primary heat treatment and secondary forging in sequence; (3) cooling after forging for the third time; (4) carrying out secondary heat treatment, primary static pressure treatment, third-time heat treatment and secondary static pressure treatment in sequence; (5) calendering to obtain the copper target material; and repeating the step (2) for at least three rounds. According to the method, by optimizing the preparation process of the copper target material, the problem of internal defects of the copper target blank is solved, internal crystal grains are sufficiently refined and uniform, and the performance of the target material is improved.

Description

technical field [0001] The invention belongs to the technical field of target material preparation, and in particular relates to a copper target material and a method for improving its internal structure. Background technique [0002] Magnetron sputtering is a substrate coating process that uses charged particles to bombard the target, so that the target atoms escape from the surface and are evenly deposited on the substrate. Magnetron sputtering has become the most excellent substrate coating process due to its advantages of high sputtering rate, low substrate temperature rise, good film-substrate bonding force, excellent metal coating uniformity and strong controllability. Magnetron sputtering is widely used in coating processes in industries such as chip manufacturing, liquid crystal display manufacturing, and solar cell manufacturing. [0003] For example, in the manufacturing process of the interconnection on the liquid crystal display (abbreviation: LCD) liquid crysta...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C14/35C22F1/08C21D9/00B23P15/00
CPCC23C14/3407C23C14/3414C23C14/35C22F1/08C21D9/0068B23P15/00
Inventor 姚力军潘杰边逸军王学泽章丽娜罗明浩
Owner KONFOONG MATERIALS INTERNATIONAL CO LTD
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