Cleaning equipment and cleaning method for reducing particles on surface

A technology for cleaning the surface of silicon wafers and equipment, which is applied in the direction of cleaning methods using tools, cleaning methods using liquids, cleaning methods and appliances, etc. To achieve the effect of improving processing quality, improving quality and product cleanliness

Pending Publication Date: 2022-01-04
杭州中欣晶圆半导体股份有限公司
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  • Claims
  • Application Information

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Problems solved by technology

[0008] Aiming at the deficiencies of the prior art, the present invention provides a cleaning device and a cleaning method for reducing particles on the surface of silicon wafers, which solves the problem that th

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  • Cleaning equipment and cleaning method for reducing particles on surface
  • Cleaning equipment and cleaning method for reducing particles on surface
  • Cleaning equipment and cleaning method for reducing particles on surface

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[0039] Next, the technical solutions in the embodiments of the present invention will be described in connection with the drawings of the embodiments of the present invention, and it is understood that the described embodiments are merely the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art are in the range of the present invention without making creative labor premise.

[0040] See Figure 1-5 The present invention provides a technical solution: a cleaning apparatus that reduces the surface particles of the silicon sheet, including the cleaning box 1, the bottom of the cleaning tank 1 fixedly connected to the base 2, and the top of the cleaning tank 1 is opened, the cleaning tank 3, the cleaning tank 3 Used to clean the product, a position adjustment mechanism 4 is provided on the cleaning box 1, and the inner portion of the cleaning tank 3 is pr...

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Abstract

The invention discloses cleaning equipment and a cleaning method for reducing particles on the surface of a silicon wafer. The cleaning equipment comprises a cleaning box, a base is fixedly connected to the bottom of the cleaning box, a cleaning tank is formed in the top of the cleaning box, a position adjusting mechanism is arranged on the cleaning box, a cleaning mechanism is arranged in the interior of the cleaning tank, a quantitative liquid supplementing mechanism is arranged on the exterior of the cleaning box. The invention relates to the technical field of silicon wafer cleaning. According to the cleaning equipment and the cleaning method for reducing the particles on the surface of the silicon wafer, the position adjusting mechanism and a clamping unit are arranged, a driving motor is used for driving a driving rotating shaft to rotate, in cooperation with transmission of a transmission gear and a transmission rack, a lifting plate is driven to move, meanwhile, clamping is carried out on a product by utilizing restoring force of a spring, positioning and clamping of the product are achieved, adjustment can be carried out on the height so that follow-up replacement and clamping can be facilitated, and therefore damage caused by collision to the product in the cleaning process is avoided, and the machining quality of the product is improved.

Description

technical field [0001] The invention relates to the technical field of silicon chip cleaning, in particular to a cleaning device and a cleaning method for reducing silicon chip surface particles. Background technique [0002] Silicon wafers must be strictly cleaned in the production of semiconductor devices. Trace pollution can also lead to device failure; the purpose of cleaning is to remove surface contamination impurities, including organic and inorganic substances; some of these impurities exist in the form of atoms or ions, and some exist in the form of thin films or particles on the surface of silicon wafers. Organic pollution includes photoresist, organic solvent residues, synthetic wax, and grease or fibers brought by human contact with devices, tools, and utensils; inorganic pollution includes heavy metals such as gold, copper, iron, chromium, etc., which seriously affect the minority carrier lifetime and Surface conductance; alkali metals such as sodium, etc., cau...

Claims

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Application Information

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IPC IPC(8): B08B3/04B08B1/04B08B13/00H01L21/67H01L21/687
CPCB08B3/04B08B1/04B08B13/00H01L21/67046H01L21/68785
Inventor 安人龙
Owner 杭州中欣晶圆半导体股份有限公司
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