Cleaning equipment and cleaning method for reducing particles on surface

Abstract

The invention discloses cleaning equipment and a cleaning method for reducing particles on the surface of a silicon wafer. The cleaning equipment comprises a cleaning box, a base is fixedly connected to the bottom of the cleaning box, a cleaning tank is formed in the top of the cleaning box, a position adjusting mechanism is arranged on the cleaning box, a cleaning mechanism is arranged in the interior of the cleaning tank, a quantitative liquid supplementing mechanism is arranged on the exterior of the cleaning box. The invention relates to the technical field of silicon wafer cleaning. According to the cleaning equipment and the cleaning method for reducing the particles on the surface of the silicon wafer, the position adjusting mechanism and a clamping unit are arranged, a driving motor is used for driving a driving rotating shaft to rotate, in cooperation with transmission of a transmission gear and a transmission rack, a lifting plate is driven to move, meanwhile, clamping is carried out on a product by utilizing restoring force of a spring, positioning and clamping of the product are achieved, adjustment can be carried out on the height so that follow-up replacement and clamping can be facilitated, and therefore damage caused by collision to the product in the cleaning process is avoided, and the machining quality of the product is improved.

Description

technical field [0001] The invention relates to the technical field of silicon chip cleaning, in particular to a cleaning device and a cleaning method for reducing silicon chip surface particles. Background technique [0002] Silicon wafers must be strictly cleaned in the production of semiconductor devices. Trace pollution can also lead to device failure; the purpose of cleaning is to remove surface contamination impurities, including organic and inorganic substances; some of these impurities exist in the form of atoms or ions, and some exist in the form of thin films or particles on the surface of silicon wafers. Organic pollution includes photoresist, organic solvent residues, synthetic wax, and grease or fibers brought by human contact with devices, tools, and utensils; inorganic pollution includes heavy metals such as gold, copper, iron, chromium, etc., which seriously affect the minority carrier lifetime and Surface conductance; alkali metals such as sodium, etc., cau...

AI Technical Summary

Problems solved by technology

[0008] Aiming at the deficiencies of the prior art, the present invention provides a cleaning device and a cleaning method for reducing particles on the surface of silicon wafers, which solves the problem that the existing products still have unclean cleaning during the cleaning process and are likely to cause product damage At the same time, there is a problem that the replacement of water cannot be completely replaced

Images