Thermoelectric device
A technology of thermoelectric devices and thermoelectric arms, applied in thermoelectric devices, thermoelectric device components, circuits, etc., can solve the problems of low withstand voltage, reduced reliability, difficult-to-oxidize metal substrates and heat sinks, etc., to achieve improved durability Effects of voltage performance, high reliability, and improved thermal conductivity
Pending Publication Date: 2022-01-11
LG INNOTEK CO LTD
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Problems solved by technology
When a metal substrate is used, although an advantageous effect can be obtained in terms of heat conduction, there is a problem that reliability decreases due to low withstand voltage during long-term use
[0009] In order to solve this problem, an attempt was made to improve the withstand voltage by oxidizing the surface of the metal substrate, but there was a problem that it was difficult to bond the oxidized metal substrate to the heat sink because the heat sink was bonded to the substrate at the high temperature part side.
Method used
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[0038] Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.
[0039] However, the technical concept of the present invention is not limited to certain embodiments to be described, but may be implemented in various other forms. At least one component in the embodiments may be selectively combined, replaced, and used within the scope of technical ideas.
[0040] In addition, unless otherwise clearly and specifically defined in context, all terms (including technical terms and scientific terms) used herein can be interpreted as having the meanings commonly understood by those skilled in the art. General terms (such as terms defined in dictionaries) should be interpreted in consideration of the meanings in the context of related technologies.
[0041] In addition, the terms used in the embodiments of the present invention are for describing the embodiments and are not intended to limit the present inv...
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Abstract
A thermoelectric device according to one embodiment of the present invention comprises: a first insulating layer; a first substrate disposed on the first insulating layer; a second insulating layer disposed on the first substrate; a first electrode disposed on the second insulating layer; a P-type thermoelectric leg and an N-type thermoelectric leg disposed on the first electrode; a second electrode disposed on the P-type thermoelectric leg and the N-type thermoelectric leg; a third insulating layer disposed on the second electrode; and a second substrate disposed on the third insulating layer, wherein the first insulating layer includes a first aluminum oxide layer, the first substrate is an aluminum substrate, the second substrate is a copper substrate, the first substrate is a low temperature portion, and the second substrate is a high temperature portion.
Description
technical field [0001] The invention relates to a thermoelectric device, and more particularly, to a substrate and an insulating layer of a thermoelectric device. Background technique [0002] The thermoelectric effect is a phenomenon that occurs due to the movement of electrons and holes inside a material, and the thermoelectric effect refers to the direct energy conversion between heat and electricity. [0003] A thermoelectric device is a general term for devices utilizing a thermoelectric effect, and has a structure in which a P-type thermoelectric arm and an N-type thermoelectric arm are joined between metal electrodes to form a PN junction pair. [0004] Thermoelectric devices can be classified into devices using resistance change according to temperature change, devices using Seebeck effect in which electromotive force is generated due to temperature difference, and devices using Peltier effect in which heat is absorbed or released due to current or the like. [0005...
Claims
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IPC IPC(8): H01L35/02H01L35/00
CPCH10N10/80H10N10/00H10N10/13H10N10/17H10N10/854
Inventor 崔万休赵容祥
Owner LG INNOTEK CO LTD