Spinning electron heterojunction and preparation method thereof
A technology of spin electrons and heterojunction, applied in the field of heterojunction, can solve the problem of low conversion efficiency of spin-orbit torque and achieve the effect of enhancing the conversion efficiency of spin-orbit torque
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Embodiment 1
[0043] CuO with perpendicular magnetic anisotropy prepared by magnetron sputtering x / Tm 3 Fe 5 o 12 Heterojunction, the specific method is as follows:
[0044] Gd 3 sc 2 Ga 3 o 12 The single crystal substrate is annealed at 1000°C for 6 hours in an oxygen environment of atmospheric pressure, and the annealed substrate is favorable for Tm 3 Fe 5 o 12 film growth;
[0045] The background vacuum of the magnetron sputtering chamber is less than 5x10 -8 mTorr(mT), the target used in magnetron sputtering is Tm 3 Fe 5 o 12 The ceramic target is radio-frequency sputtering, the sputtering power is 100w, and the sputtering time is 30 minutes. The final prepared Tm 3 Fe 5 o 12 The thickness is 4nm. During the sputtering process, the work is Ar, the pressure is 6mT, a small amount of oxygen is introduced, and the oxygen flow rate is 3% of the Ar flow rate. During the sputtering process, the substrate temperature is kept at 600°C; No need for annealing;
[0046] Subseq...
Embodiment 2
[0050] CuO with perpendicular magnetic anisotropy prepared by magnetron sputtering x / Tm 3 Fe 5 o 12 Heterojunction, the specific method is as follows:
[0051] Gd 3 Ga 5 o 12 The single crystal substrate is annealed at 1100°C for 7 hours in an atmosphere of oxygen at atmospheric pressure, and the annealed substrate is favorable for Tm 3 Fe 5 o 12 film growth;
[0052] The background vacuum of the magnetron sputtering chamber is less than 5x10 -8 mTorr(mT), the target used in magnetron sputtering is Tm 3 Fe 5 o 12 The ceramic target adopts radio frequency sputtering, the sputtering power is 100w, and the sputtering time is 50 minutes. The final prepared Tm 3 Fe 5 o 12 The thickness is 8nm. During the sputtering process, the work is Ar, the air pressure is 8mT, a small amount of oxygen is introduced, and the oxygen flow rate is 5% of the Ar flow rate. During the sputtering process, the substrate temperature is kept at 800°C; No need for annealing;
[0053] Su...
Embodiment 3
[0056] CuO with perpendicular magnetic anisotropy prepared by magnetron sputtering x / Tm 3 Fe 5 o 12 Heterojunction, the specific method is as follows:
[0057] Gd 3 sc 2 Ga 3 o 12 The single crystal substrate is annealed at 900°C for 6 hours in an atmosphere of oxygen at atmospheric pressure, and the annealed substrate is favorable for Tm 3 Fe 5 o 12 film growth;
[0058] The background vacuum of the magnetron sputtering chamber is less than 5x10 -8 mTorr(mT), the target used in magnetron sputtering is Tm 3 Fe 5 o 12 The ceramic target adopts radio frequency sputtering, the sputtering power is 100w, and the sputtering time is 90 minutes. The final prepared Tm 3 Fe 5 o 12 The thickness is 12nm. During the sputtering process, the work is Ar, the air pressure is 6mT, a small amount of oxygen is introduced, and the oxygen flow rate is 3% of the Ar flow rate. During the sputtering process, the substrate temperature is kept at 500°C; No need for annealing;
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