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Method for manufacturing hollow structure and method for manufacturing hollow package
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A manufacturing method and structure technology, which is applied in semiconductor/solid-state device manufacturing, photo-plate-making process exposure device, pattern surface photo-plate-making process, etc., can solve the problem of easy deformation of the top plate, and achieve the effect of suppressing deformation
Pending Publication Date: 2022-01-21
TOKYO OHKA KOGYO CO LTD
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Problems solved by technology
[0013] However, in the method of producing the hollow structure described in Patent Document 1, there is a problem that the membranous top plate is easily deformed due to the aforementioned curing operation when forming the cavity securing portion.
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no. 1 Embodiment approach ＞
[0095]In step (0), when preparing a photosensitive resist film formed of a laminated film in which a photosensitive resin film is laminated on a base film as the photosensitive resist film, step (i), step (i) and step (ii), process (iii), process (iv), and the form of process (v).
[0096] Moreover, the heat treatment in the said process (v) is performed by the operation (x) which heats at the temperature of 150 degreeC or less for 10 minutes or more, and further heats at the temperature higher than 150 degreeC.
[0097] figure 1 It is a schematic diagram explaining the manufacturing method of the hollow structure concerning 1st Embodiment.
[0098] figure 1 Among them, the substrate having the concave portion 15 on the surface is constituted by the substrate 10 and the side wall 20 formed on the substrate 10 . As the photosensitive resist film, a photosensitive resist film formed of a laminated film 80 in which the photosensitive resin film 30 is laminated on the base film...
no. 2 Embodiment approach ＞
[0133] In step (0), when preparing a photosensitive resist film formed of a laminated film in which a photosensitive resin film is laminated on a base film as the photosensitive resist film, step (i), step (i) and step (ii), process (iii), process (iv), process (v') mode.
[0134] In addition, an embodiment in which the heat treatment in the aforementioned step (v') is performed by an operation (y) of heating at a temperature of 100°C or higher after irradiating ultraviolet rays.
[0135] The description of the process (i), process (ii), process (iii) and process (iv) in the second embodiment is the same as that of the process (i), process (ii) and process ( The description of iii) and step (iv) is the same.
[0136] [Process (v')]
[0137] In step (v'), the developed negative pattern (exposed part) is further subjected to heat treatment (curing operation) to cure it, and obtain a hollow structure in which the top plate part is formed of a cured body of the photosensitive re...
Embodiment
[0515] Hereinafter, the present invention will be described in further detail through examples, but the present invention is not limited by these examples. "Part" in description of each manufacture example shows a mass part.
[0516]
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Abstract
The invention relates to a method for manufacturing a hollow structure and a method for manufacturing a hollow package. The method for manufacturing the hollow structure which can stably manufacture the hollow structure with improved strength by suppressing deformation of a top plate part by a curing operation is provided.The method method for manufacturing the hollow structure comprises the following steps of a step for disposing a photosensitive resist film having a negative photosensitive resin film; a step for exposing the disposed photosensitive resin film; a step for heating the exposed photosensitive resin film; a step for developing the heat-treated photosensitive resin film to form a negative pattern; a step for curing the negative pattern after development by further performing heat treatment so as to obtain a hollow structure in which the top plate part is formed from a cured body of the photosensitive resin film; a step for heating after development by an operation of heating at a temperature of 150 DEG C or lower for 10 minutes or more, then heating at a temperature of more than 150 DEG C, or an operation of heating at a temperature of 100 DEG C or higher after irradiation with ultraviolet rays.
Description
technical field [0001] The present invention relates to a method of manufacturing a hollow structure and a method of manufacturing a hollow package. Background technique [0002] In recent years, the development of tiny electronic devices such as surface elastic wave (SAW) filters has continued to progress. A package in which such an electronic device is sealed has a hollow structure for ensuring propagation of surface acoustic waves and movability of a movable member of the electronic device. [0003] In order to form the hollow structure, a photosensitive resin composition can be used, and a package can be produced by mold-molding the wiring board on which the electrodes are formed while maintaining the hollow state. [0004] For example, Patent Document 1 discloses a method of manufacturing a hollow package, which includes the step of forming a cavity ensuring portion so as to cover a microelectromechanical system (MEMS) formed on a substrate. , thereby producing a holl...
Claims
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