Eutectic welding equipment
A technology for eutectic welding and equipment, applied in the field of eutectic welding equipment, can solve problems such as affecting welding quality and adverse effects, and achieve the effect of avoiding adverse effects and improving quality
Active Publication Date: 2022-01-28
恩纳基智能科技无锡有限公司
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Problems solved by technology
[0003]
During the eutectic soldering process, since the solder plating layer on the surface of the bottom sheet will change in volume as the temperature changes, from solid to liquid, during this process, there will be a slight friction between the chip and the substrate. Dislocation, if this dislocation is not corrected or avoided during the welding process, it will seriously affect the final welding quality and have adverse effects
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[0029] The present invention will be described in detail below in conjunction with the implementations shown in the drawings, but it should be noted that these implementations are not limitations of the present invention, and those of ordinary skill in the art based on the functions, methods, or structural changes made by these implementations Equivalent transformations or substitutions all fall within the protection scope of the present invention.
[0030] It should be understood that in this application the terms "central", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear" , "Left", "Right", "Vertical", "Horizontal", "Top", "Bottom", "Inner", "Outer", "Axial", "Radial", etc. indicate the orientation or positional relationship as Based on the orientation or positional relationship shown in the drawings, it is only for the convenience of describing the technical solution and simplifying the description, and does not indicate or imp...
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The invention provides eutectic welding equipment. The eutectic welding equipment comprises a carrying platform, a first adjusting assembly, a welding head assembly and a second adjusting assembly; the first adjusting assembly comprises a first motor, a first lead screw directly connected with the first motor and a first transverse rod in threaded connection with the first lead screw; the welding assembly comprises a chip cover and a suction rod which is movably arranged in the chip cover and moves up and down relative to the chip cover, wherein the chip cover is fixedly connected to the first transverse rod; the second adjusting assembly is arranged on the first transverse rod and used for driving the suction rod to move up and down; and the chip cover comprises a holding cylinder part and a positioning part, a positioning cavity with a downward opening is defined by the positioning part, and the section shape of the positioning cavity on the horizontal plane is matched with the shape of a chip to be welded. Through the eutectic welding equipment, dislocation generated between the chip and a substrate during eutectic soldering is corrected or avoided, the welding quality is improved, and adverse effects are avoided; and the pressure between the chip and the substrate can be controlled in real time.
Description
technical field [0001] The invention relates to the technical field of semiconductor processing, in particular to eutectic welding equipment. Background technique [0002] Eutectic soldering technology is widely used in the electronic packaging industry, such as the bonding of chips and substrates, the bonding of substrates and shells, and the capping of shells, etc. Eutectic welding, also known as low-melting point alloy welding, its basic characteristic is to form an alloy of two different metals in a certain weight ratio at a temperature far below their respective melting points. Compared with traditional epoxy conductive adhesive bonding, eutectic welding has the advantages of high thermal conductivity, low resistance, fast heat transfer, strong reliability, and large shear force after bonding, and is suitable for high-frequency and high-power devices The interconnection between the chip and the substrate, the substrate and the shell. [0003] During the eutectic solde...
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Login to View More IPC IPC(8): B23K3/00H01L21/67
CPCB23K3/00H01L21/67Y02P70/50
Inventor 吴超
Owner 恩纳基智能科技无锡有限公司