A method for sub-regional testing of lamp board fixtures

Abstract

The invention discloses a method for sub-regional testing of a lamp board fixture, comprising the following steps: Step 1, based on the measurement point patterns on both sides of the lamp board to be tested, make a fixture for the C side according to 1:1, and search for the S side according to the network order. Rules, take the part with the same rules as a partition, and divide the S surface into N partitions; step 2, make test data corresponding to the N partitions, make a jig based on the test data, and use the jig to test different partitions respectively. The sub-regional testing method of the lamp board fixture can realize the test of high-density lamp board products, reduce the manufacturing cost of the fixture, and improve the test efficiency.

Description

technical field [0001] The invention relates to a sub-regional testing method for a lamp board fixture. Background technique [0002] Traditional test fixtures have three test methods: [0003] Method 1: After the printed circuit board is formed, the unit is set, and the fixture is made according to the set size of the circuit board at 1:1, and all the window PADs on the board are tested by needles; [0004] Method 2: After the printed circuit board is formed, the unit is set, and the fixture is made according to the size of the circuit board set at 1:1. The network is distinguished for all the window PADs on the board, and two or more sets of fixtures are made, respectively. carry out testing; [0005] Method 3: After the printed circuit board is formed, the unit is set. The set is composed of multiple pcs. The fixture is made according to single or multiple pcs. A set is tested multiple times according to the number of pcs to complete the whole set test. . [0006] The...

AI Technical Summary

Problems solved by technology

[0006] The above three fixture manufacturing methods can meet the requirements of most PCB products such as through-holes and HDI, but cannot meet the testing requirements of high-density light board products. The analysis is as follows:

[0007] (1) The light board product has the characteristics of large single PCS area, large number of PADs on the lamp bead surface, and high density. When the size of the light board product is large, it may exceed the equipment test area, resulting in failure to test; When it is small, the density of the PAD on the lamp bead surface will be relatively high, resulting in a large slope of the fixture, which exceeds the equipment process capability. Due to the limit requirements of the test machining area and the processing slope, the lamp board is in the area and density. It exceeds the capacity of the equipment, and conventional fixtures and equipment cannot meet the demand;

[0008] (2) Although the flying probe test can be used, the production capacity is too low to meet the demand for mass production, which increases the test cost; you can also purchase large-scale equipment or high-end matching products for production, but the cost of equipment will be high

Images