Method for improving Source Line dark line

Abstract

The invention discloses a method for improving a Source Line dark line, and the method comprises the following steps: S1, employing a photomask or film deposition mode, employing physical vapor deposition (PVD) and chemical vapor deposition (CVD) to carry out the film formation of a metal and an inorganic compound, achieving a good film formation effect, and completing the production of a TFT through the processes of film formation, exposure and development, etching, and film stripping; S2, increasing the width of a Vcom metal wire of a lower-layer metal pixel in the BC layer or the PE layer at the overlapped part of the two layers of metal; and S3, widening the width in the Vcom from W1 to W2, and reducing RC loading of the pixel, so that the light resistance on the metal wire in the BC layer or the PE layer is not on the two sides of the metal due to Vcom. According to the invention, the metal wiring width of the lower-layer metal pixel Vcom in the BC layer or the PE layer is increased at the overlapping part of the two layers of metal, so that the photoresist on the metal wire in the BC layer or the PE layer is not on the two sides of the metal due to Vcom, the online photoresist of Vcom metal cannot be thinned, the condition that the GI insulating layer is broken is avoided, the panel yield is improved, and the production cost is reduced.

Description

technical field [0001] The invention belongs to the technical field of displays, and in particular relates to a method for improving dark lines of Source Lines. Background technique [0002] For TFT-LCD displays, when the panel size is getting larger and larger, especially for horizontal screen panels, the Vcom stability requirements are relatively strict. Generally, the Vcom of the display area is from the left and right ends of the display area, and the signal is carried out through the ITO material. Supply, that is, the Vcom of the pixel is transmitted by ITO (as shown in Figure 1), because when the panel size is larger, the RC Loading relative to Vcom will be larger, and the horizontal Crosstalk phenomenon will become more and more serious ( Such as figure 2 As shown), in order to countermeasure this problem, a new metal is generally added to pass Vcom (such as image 3 Shown), reduce its RC Loading, and then solve the horizontal Crosstalk problem. [0003] Since addi...

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Problems solved by technology

[0003] Since adding metal to transmit Vcom will reduce the transmittance, the width of the metal design should not be too wide. Because of this, when digging GI holes, the photoresist on the Vcom metal line is too thin and GI is generated. voids (such as Figure 4-5 shown), which in turn will cause a hole in the insulating layer on the Vcom metal layer, resulting in a short circuit between the two metal layers of the trace (such as Figure 6-7 As shown), resulting in bright lines of the Source line, generally can be countermeasures by thickening the photoresist, but it will increase the production cost

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