High-density interconnection system packaging device and manufacturing method thereof

Abstract

The invention discloses a high-density interconnection system packaging device which comprises a high-density embedded wire circuit board which is formed by embedding a wire into a prepreg and then carrying out heating and pressurization to enable a glue solution of the prepreg to be cured so as to form the high-density embedded wire circuit board, and the wire is provided with a wiring end; and the device also comprises a chip which is arranged on the high-density embedded wire circuit board, and a connecting pin of the chip is connected with the wiring end of the wire. The manufacturing method of the high-density interconnection system packaging device comprises the steps that the wire is implanted into the prepreg, then heating and pressurizing are carried out, so that a glue solution of the prepreg is cured to form the high-density embedded wire circuit board, and the wire forms a wiring end; the chip is arranged on the high-density embedded wire circuit board, and the connecting pin of the chip is connected with the wiring end of the wire. Therefore, the wire width and the wire distance of the wire layer on the high-density embedded wire circuit board are 1-2 microns, the wiring density is increased, and the communication density between chips is increased; due to the increase of the density of the wires, the arrangement quantity of the chips is increased, the size of the packaging bag is reduced, and more information transmission and data communication are realized.

Description

technical field [0001] The invention relates to the field of semiconductor products, in particular to a high-density interconnection system packaging device. [0002] The present invention relates to the field of semiconductor manufacturing methods, in particular to a manufacturing method of high-density interconnection system packaging devices. Background technique [0003] The 21st century is the information age, and the information industry is an important force to promote the continuous progress of human society. The modern information industry covers many manufacturing fields, among which chip manufacturing, electronic packaging and product testing are all essential production processes. Electronic packaging is a multidisciplinary high-tech industry, involving machinery, electronics, materials, physics, chemistry, optics, mechanics, heat, electromagnetics, communication, computer, control and other disciplines, and has become one of the key areas for the development of...

AI Technical Summary

Problems solved by technology

[0006] This solution is too costly and has many constraints, such as chips from different technology nodes, from different Si suppliers, or integrated into larger packages

Moreover, the traditional etching process to produce transmission lines cannot guarantee the line width and line spacing. The current process is about 5-7μm line width and line spacing, while the general system packaging and interconnection technology needs 1-2μm to meet the density requirements.

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