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Electronic packaging piece and packaging method

An electronic package and packaging method technology, applied in electrical components, electric solid devices, circuits, etc., can solve the problems of chip interference and complex electromagnetic shielding function technology, so as to avoid electromagnetic interference and solve the complex problem of electromagnetic shielding function technology. Effect

Pending Publication Date: 2022-01-28
华天科技(南京)有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to solve the problems in the prior art, provide an electronic package and a packaging method, avoid mutual electromagnetic interference between chips, and solve the complex problem of realizing the electromagnetic shielding function process

Method used

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  • Electronic packaging piece and packaging method
  • Electronic packaging piece and packaging method
  • Electronic packaging piece and packaging method

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Embodiment Construction

[0036] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments It is a part of embodiments of the present invention, but not all embodiments. The components of the embodiments of the invention generally described and illustrated in the figures herein may be arranged and designed in a variety of different configurations.

[0037] Accordingly, the following detailed description of the embodiments of the invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely represents selected embodiments of the invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art wi...

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Abstract

The invention discloses an electronic packaging piece and a packaging method. According to the invention, a first chip and a second chip are mounted on the same side of a substrate; a ground wire is arranged in the substrate; an electromagnetic shielding device is arranged on one side of the first chip; a molding compound is hermetically connected with the substrate; and a solder ball is installed on the other side of the substrate. The first chip and the second chip are mounted on the substrate of the embedded ground wire through the reflow soldering technology, the electromagnetic shielding device is mounted above the first chip through the tin scratching technology, electromagnetic shielding of the chips is achieved, plastic packaging is conducted through the MUF technology, the solder balls are installed on one side of the substrate, and the electronic packaging piece with the electromagnetic shielding function is obtained. Meanwhile, the top of the first chip can be coated with heat-conducting glue, and the MUF is combined with a bare chip process for plastic packaging, so that the electronic packaging piece with the electromagnetic shielding function and the heat dissipation function is obtained. According to the invention, mutual electromagnetic interference of the chips can be effectively avoided, and the problem of complex process for realizing the electromagnetic shielding function at present is solved.

Description

technical field [0001] The invention belongs to the field of semiconductor packaging, and relates to an electronic package and a packaging method. Background technique [0002] As the number of chips in the system-in-package increases, the electromagnetic waves generated by the chips will inevitably interfere with their normal work. Therefore, electromagnetic shielding is indispensable in system-in-packages. At present, the system-in-package usually installs the ground wire device on the edge of the dicing line and the substrate. For chips that need to be isolated separately, grooves are made around it to remove the plastic sealant, and then filled with conductive silver glue. After cutting into individual chips, It is connected to the ground wire and silver glue through metal sputtering to meet the electromagnetic shielding requirements of related chips. However, this kind of processing technology is complicated, the cost is high, and the cutting deviation will also affec...

Claims

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Application Information

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IPC IPC(8): H01L23/552H01L21/50H01L21/56
CPCH01L23/552H01L21/50H01L21/563
Inventor 陶剑
Owner 华天科技(南京)有限公司
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