High-stability light emitting diode chip and manufacturing method thereof

Abstract

The invention provides a high-stability light emitting diode chip and a manufacturing method thereof, and belongs to the technical field of semiconductors. A first conduction hole extending to an N-type electrode and a second conduction hole extending to a P-type electrode are formed in an insulating layer of the chip, and welding spots comprise first welding spots and second welding spots. The first welding spots are located in the first conduction holes and on the surface of the insulating layer and electrically connected with the corresponding N-type electrodes, and the second welding spots are located in the second conduction holes and on the surface of the insulating layer and electrically connected with the corresponding P-type electrodes. The parts, located on the surface of the insulating layer, of the first welding spot and the second welding spot are each of a circular truncated cone structure, and the diameter of the cross section of each circular truncated cone structure is gradually decreased in the stacking direction of the chip. And a part of the protective layer of the chip is also coated on the side walls of the circular truncated cone structures of the first welding spot and the second welding spot. By adopting the light emitting diode chip, water vapor and other pollutants can be prevented from permeating between the protective layer and the side wall of the circular truncated cone structure, and the reliability of the light emitting diode chip is improved.

Description

technical field [0001] The present disclosure relates to the technical field of semiconductors, in particular to a highly stable light-emitting diode chip and a manufacturing method thereof. Background technique [0002] A light emitting diode (English: Light Emitting Diode, referred to as: LED) is a semiconductor device that can emit light. By using different semiconductor materials and structures, LEDs can cover a full color range from ultraviolet to infrared, and have been widely used in economic life such as display, decoration, and communication. [0003] The chip is the core device of the LED. In related technologies, the LED chip includes a substrate, an N-type semiconductor layer, an active layer, a P-type semiconductor layer, an N-type electrode, a P-type electrode, an insulating layer, and solder joints; an N-type semiconductor layer, The active layer and the P-type semiconductor layer are sequentially stacked on the surface of the substrate; the P-type semiconduc...

AI Technical Summary

Problems solved by technology

With the refinement of the display market, the requirements for the chip size are getting higher and higher. When the chip size is small, the electrodes block the light very seriously. At this time, the brightness cannot meet the display requirements, so Mini LED chips are produced.

[0004] The solder joints of Mini LED usually need to be exposed to the outside to facilitate subsequent soldering, but the metal side wall in Mini LED is relatively steep

Such exposed solder joints will slowly infiltrate water vapor and other pollutants from the side during use, which will cause corrosion and other problems on the interface, and finally lead to a decrease in chip reliability, which is not conducive to product promotion.

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