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PCB differential via hole design method and PCB design method

A technology of differential vias and design methods, applied in the direction of electrical connection formation of printed components, electrical components, printed circuits, etc., can solve the problems of inability to refer to the GND plane, unfavorable high-speed signal transmission, and large occupied space to avoid cross-segmentation problems, improved transmission quality, effects of adequate wiring space

Active Publication Date: 2022-01-28
INSPUR SUZHOU INTELLIGENT TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The horizontal, horizontal and vertical arrangement of differential holes in the prior art takes up a relatively large space, and in the horizontal direction, there will be a large crosstalk between signals, which is not conducive to the transmission of high-speed signals
And it is usually necessary to dig the Antipad in the inner layer. Due to space constraints, the 10-degree routing of the differential signal is very easy to be very close to the edge of the Antipad, and it is even impossible to refer to the complete GND plane, resulting in cross-segmentation problems.

Method used

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  • PCB differential via hole design method and PCB design method
  • PCB differential via hole design method and PCB design method
  • PCB differential via hole design method and PCB design method

Examples

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Embodiment 1

[0036] Please refer to figure 1 and figure 2 , the present embodiment provides a PCB differential via design method, comprising the following steps:

[0037] S1. Divide the combination of differential vias on the same layer into the first pair of holes 1 and the second pair of holes 2. Both the first pair of holes 1 and the second pair of holes 2 include two vias. Set the first pair of holes 1 and the second pair of holes. Internal via spacing of two pairs of holes 2;

[0038] S2. The connecting line of the center of the first pair of holes 1 and the axis of the differential signal pin 4 form an angle of 45°;

[0039] S3, locate the perpendicular bisector of the connecting line of the center of the first pair of holes 1, and create the second pair of holes 2 on the perpendicular bisector according to the set distance between the first pair of holes 1 and the second pair of holes 2 to Make the connecting line of the centers of the second pair of holes 2 coincide with the pe...

Embodiment 2

[0041] This embodiment provides a PCB differential via design method, please refer to image 3 ,include:

[0042] If there is a combination of two layers of differential vias, taking the differential vias of the golden finger as an example, a coordinate system is established with the center point of the leftmost pin of a group of differential signal pins 4 as the origin.

[0043] Create the first layer of differential signal via combinations (TX differential vias) on the coordinate system, where the via coordinates of the first layer of differential signal via combinations are respectively Among them, a is the via hole spacing in the pair of holes, b is a set constant, and c is the minimum distance between the center connection line of the first pair of holes 1 and the center of the second pair of holes 2 in the combination of differential vias in the same layer;

[0044] Create a second-layer differential signal via combination (RX differential via) on the coordinate syst...

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Abstract

The invention provides a PCB differential via hole design method and a PCB design method.The PCB differential via hole design method comprises the following steps: a same-layer differential via hole combination is divided into a first pair of holes and a second pair of holes, each of the first pair of holes and the second pair of holes comprises two via holes, and the internal via hole distance of the first pair of holes and the internal via hole distance of the second pair of holes are set; an included angle of 45 degrees is formed between the connecting line of the circle centers of the first pair of holes and the axis of the differential signal pin; and a vertical bisector of a circle center connecting line of the first pair of holes is positioned , anda second pair of holes are created on the vertical bisector according to a set distance between the first pair of holes and the second pair of holes so as to enable a circle center connecting line of the second pair of holes to coincide with the vertical bisector. According to the invention, the design method of the differential via holes is improved, and the punching mode of the differential via holes at the golden fingers is changed, so that the crosstalk between high-speed signals is optimized, the integrity of the signals is improved, and the transmission quality of the high-speed signals is improved.

Description

technical field [0001] The invention belongs to the technical field of layout design, and in particular relates to a PCB differential via design method and a PCB design method. Background technique [0002] With the development of electronic technology and the increase of signal rate, people have put forward higher requirements for the performance of the signal. In the process of research and development, R&D designers need to consider and deal with many problems in the PCB design process more carefully, so as to Pursue the minimization of cost on the basis of performance optimization. [0003] In a high-speed printed circuit board (PCB), vias have long been criticized for degrading signal integrity performance. However, the use of vias is unavoidable. On a standard PCB, components are placed on the top layer, while differential pairs are traced on the inner layers. Inner layers have lower electromagnetic radiation and pair-to-pair crosstalk. Vias must be used to connect...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/00H05K3/40
CPCH05K3/00H05K3/4038H05K2201/095
Inventor 李雅君
Owner INSPUR SUZHOU INTELLIGENT TECH CO LTD