Flexible multi-layer printed circuit board

Abstract

The invention relates to the technical field of electronic communication, in particular to a flexible multi-layer printed circuit board. The flexible multi-layer printed circuit board comprises a circuit board body and a plurality of groups of wiring layers embedded in the circuit board body, and two groups of board protecting components are arranged and are respectively positioned in embedding cavities formed in the two sides of the circuit board body. According to the flexible multi-layer printed circuit board provided by the invention, when the working temperature of the flexible multi-layer printed circuit board is higher than a preset melting point value of the material of a fusing spacer, the fusing spacer and a metal disc are fused, so that a baffle on the fusing spacer cannot block a frame connecting sheet, the limitation on the frame connecting piece is eliminated, a triggering assembly can impact a sodium azide block, the flexible multi-layer printed circuit board can be quickly and effectively protected, manual monitoring and control are not needed, and the operation is simple and convenient.

Description

technical field [0001] The invention relates to the technical field of electronic communication, in particular to a flexible multilayer printed circuit board. Background technique [0002] Flexible Printed Circuit (FPC) is a highly reliable and excellent flexible printed circuit board made of polyimide or polyester film as the base material. It has the characteristics of high wiring density, light weight, thin thickness, and good bendability. Flexible printed circuit (FPC), also known as flexible printed circuit, flexible printed circuit, is light in weight, thin in thickness, and flexible. It is favored for its excellent features such as free bending and folding... However, the quality inspection of FPC in China mainly relies on manual visual inspection, which is costly and inefficient. With the rapid development of the electronics industry, the design of circuit boards is becoming more and more high-precision and high-density. Traditional manual inspection methods can no ...

AI Technical Summary

Problems solved by technology

It has the characteristics of high wiring density, light weight, thin thickness, and good bendability. Flexible printed circuit (FPC), also known as flexible printed circuit, flexible printed circuit, is light in weight, thin in thickness, and flexible. Excellent features such as free bending and folding are favored... However, the quality inspection of FPC in China mainly relies on manual visual inspection, which is costly and inefficient

With the rapid development of the electronics industry, the design of circuit boards is becoming more and more high-precision and high-density. Traditional manual inspection methods can no longer meet production needs. FPC defect automatic inspection has become an inevitable trend of industrial development.

[0003] At present, the physical properties of flexible multilayer circuit boards are similar to those of polyimide, which has a low dielectric constant and absorbs little moisture, but is not resistant to high temperatures.

Polyesters have a melting point of 250°C and a glass transition temperature (Tg) of 80°C, which limits their use in applications that require a large number of end solderings, when part of the flexible multilayer printed circuit board occurs due to part of the working environment Abnormal high temperature, resulting in the flexible circuit board being easily damaged by high temperature and cannot be automatically protected

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