Efficient etching machine for new energy photovoltaic wafer

Abstract

The invention discloses an efficient etching machine for a new energy photovoltaic wafer in the technical field of etching machines. The efficient etching machine comprises a protective shell, the inner side of the protective shell is provided with a placement mechanism for clamping and placing the photovoltaic wafer, and the left and right sides of the placement mechanism are connected with a conversion mechanism for driving the placement mechanism to rotate and convert the photovoltaic wafer; the photovoltaic wafer is stably supported by the placement mechanism when double-sided etching is carried out on the photovoltaic wafer every time, and after one side of the photovoltaic wafer is etched, the placement mechanism is rotated by matching with the conversion mechanism, and the placement mechanism is closed firstly to make the photovoltaic wafer clamped stably, so that the photovoltaic wafer is prevented from sliding out in the rotating process; and after conversion, the conversion mechanism opens the middle part of the placement mechanism, so that the placement mechanism is prevented from interfering with etching liquid to etch the photovoltaic wafer, the etching effect of the etching liquid on the photovoltaic wafer is ensured, and the two surfaces of the photovoltaic wafer are quickly etched.

Description

technical field [0001] The invention relates to the technical field of etching machines, in particular to a high-efficiency etching machine for new energy photovoltaic wafers. Background technique [0002] Etching is the technique of removing material using chemical reaction or physical impact. Etching technology can be divided into wet etching and dry etching. After continuous improvement and process equipment development, it can be used in the processing of electronic thin slices, wafers and precision etching products in the aviation, mechanical, and chemical industries. Especially in semiconductor manufacturing processes, etching It is an indispensable technology. [0003] In the prior art, when wet etching the photovoltaic wafer, only one side of the photovoltaic wafer can be etched. When the photovoltaic wafer needs to be etched on both sides, it is necessary to etch one side first, then take it out and put it into the other side for etching. In this process, not only...

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to provide a high-efficiency etching machine for new energy photovoltaic wafers, to solve the above-mentioned background technology. When performing double-sided etching on a photovoltaic wafer, it is necessary to etch one side first, then take it out and put it into the other side for etching. In this process, not only the etching efficiency is reduced, but also part of the etching solution stays on the photovoltaic wafer after one etching. The surface, when taken out, the etching solution is easy to splash, reducing the service life of the etching machine

Images