Preparation method and application of wafer bonding wax sheet

Abstract

The invention relates to a preparation method and application of a wafer bonding wax sheet, and the preparation method comprises the following steps of: putting bonding wax into a roller coating hot melt gluing machine, heating the bonding wax until the bonding wax is melted, starting the roller coating hot melt gluing machine at a rotating speed of 5-10r / min, adjusting the thickness of a glue film to 0.1-0.15mm, and pasting a double-sided non-dry sticker in a roller, with the width of the double-sided non-dry sticker being more than 20cm, coating the wax on the double-sided non-dry sticker, cooling the obtained waxed sticker, and winding and storing the waxed sticker to obtain the wafer bonding wax sheet. The application comprises the following specific steps of: taking a to-be-processed single wafer, pasting the obtained wafer bonding wax sheet on one surface of the to-be-processed single wafer, uncovering the surface cover paper of the wafer bonding wax sheet, pasting the wafer bonding wax sheet on a polishing disk, heating and flattening the polishing disk, cooling the polishing disk, and polishing and processing the wafer bonding wax sheet on a polishing machine. The wax sheet can be controlled to adapt to the sizes of different single wafers to change the size, convenience and high efficiency are achieved, the wax sheet adapts to various different conditions, the machining time is shortened, the efficiency is improved, polishing machining is more accurate, and material waste is avoided.

Description

technical field [0001] The invention relates to a preparation method and application of a wafer bonding wax sheet, and belongs to the technical field of bonding wax for wafer polishing. Background technique [0002] During wafer processing, the cut single wafer needs to be rounded and polished, which is a process of fixing the single wafer on the polishing disc, and then removing it for cleaning after polishing. At present, the material used for fixing is mainly hot-melt adhesive wax. The specific process is to heat the polishing disc above the melting point of the adhesive wax, and then apply the adhesive wax on the hot polishing disc to form a layer of wax liquid, and then use a roller or Apply the wax liquid evenly with the scraper, then put the single wafer (usually 4 to 6 pieces) on the polishing disc, flatten it and cool it, then move the polishing disc to the polishing machine for polishing. [0003] There is an obvious defect in this process, that is, no matter how ...

AI Technical Summary

Problems solved by technology

[0003] There is an obvious defect in this process, that is, no matter how many single wafers are polished at a time, the entire polishing disc needs to be coated with adhesive wax, resulting in waste of resources, and because of the high fluidity of the wax liquid, it is difficult to The uniformity cannot be controlled, resulting in insufficient level when the single wafer is fixed, and the wafer often has defective products with excessive thickness deviation after polishing