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Clearing moistening film adhesive tape as well as preparation method and application thereof

A technology of cleansing and stripping, applied in the field of cleansing film strips, can solve the problems of cleansing mold strips with strong odor, strong odor, and secondary pollution, and achieve high film cleaning efficiency, cost reduction, and low odor effects

Pending Publication Date: 2022-02-18
CYBRID TECHNOLOGIES INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The problems of the current mold cleaning strips are: 1) With the improvement of environmental protection requirements, the mold dirt components become complicated, the cleaning ability of the mold cleaning strips is not enough, and the existing mold cleaning strips have a strong smell; 2) mold cleaning After the glue strip is cleaned, there are often residues on the surface of the mold, which makes demoulding difficult, resulting in secondary pollution for subsequent packaging
However, the vulcanizing agent system of this method is sulfur, and the odor is very large during the vulcanization process, which will produce unpleasant odors in the workshop

Method used

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  • Clearing moistening film adhesive tape as well as preparation method and application thereof
  • Clearing moistening film adhesive tape as well as preparation method and application thereof
  • Clearing moistening film adhesive tape as well as preparation method and application thereof

Examples

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preparation example Construction

[0042] The preparation method of the clear and moisturizing film adhesive strip of the present invention comprises the following steps:

[0043] 1) masticating the uncrosslinked rubber;

[0044] 2) Mix fillers, detergents, cleaning aids, lubricants, and coupling agents according to the proportion, then banbury, and add cross-linking agent to continue banbury;

[0045] 3) Mix the materials in step 1) and step 2), knead them, and cut them to obtain the moisturizing film strips.

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Abstract

The invention discloses a clearing moistening film adhesive tape and a preparation method and application thereof. The clearing moistening film adhesive tape is prepared from the following components in parts by weight: 100 parts of uncrosslinked rubber, 0.2 to 20 parts of a cleaning agent, 0.1 to 10 parts of a cleaning auxiliary agent, 0.1 to 5 parts of a lubricating agent, 0.1 to 5 parts of a coupling agent, 0.1 to 5 parts of a cross-linking agent and 1 to 80 parts of filler. The clearing moistening film adhesive tape disclosed by the invention is low in smell, high in film cleaning efficiency, easy to demould, capable of effectively prolonging the film cleaning and moistening period and reducing the cost, and particularly suitable for cleaning a semiconductor packaging mold.

Description

technical field [0001] The invention relates to the technical field of moisturizing film adhesive strips, in particular to a moisturizing film adhesive strip and its preparation method and application. Background technique [0002] During the continuous packaging and molding process of semiconductor devices, components such as epoxy molding compound and mold release agent will adhere and interact with the coating on the surface of the mold at high temperature, forming dirt that is difficult to remove. If it is not removed in time, it will not only cause difficulty in releasing the package during packaging, but also cause defects in the appearance of the package. Therefore, the cleaning of packaging molds is a very important part for semiconductor packaging companies. [0003] The currently used mold cleaning materials are mainly divided into two categories: one is melamine mold cleaning materials, and the other is mold cleaning strips. Melamine mold cleaning material is a ...

Claims

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Application Information

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IPC IPC(8): C08L23/16C08L11/00C08L9/00C08L9/06C08L71/02C08L91/06C08L23/30C08K5/20C08K5/09C08K5/06C08K5/17
CPCC08L23/16C08L11/00C08L9/00C08L9/06C08K5/20C08K5/09C08K5/06C08K2201/014C08L71/02C08L91/06C08K5/17C08L23/30
Inventor 程孝春王磊朱玲玲陈洪野吴小平
Owner CYBRID TECHNOLOGIES INC
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