Chip ball mounting tool and method based on computer whole machine manufacturing process

Abstract

The invention discloses a chip ball mounting tool and method based on a whole computer manufacturing process, and relates to the technical field of chip ball mounting. The tool comprises a chip positioning jig used for positioning a chip to be subjected to ball mounting, the chip positioning jig comprises a positioning frame, sliding holes are formed in the two sides of the positioning frame, a supporting table used for placing the chip is arranged in the positioning frame, at least two sliding rods are movably arranged in the positioning frame, and movable grooves, movable cavities and movable holes are sequentially formed in the sliding rods. The chip positioning jig, the height adjusting block and the chip ball mounting jig are arranged, the chip positioning jig is used for clamping and positioning a chip, the height adjusting block is used for adjusting according to the thickness of the chip, and finally, the chip ball mounting jig is used for assisting in solder paste coating and ball mounting operation on the chip, so that the operation mode is simple and rapid. In the process, the chip is not scratched, tin paste coating is uniform and rapid, and the method has a wide application prospect.

Description

technical field [0001] The invention relates to the technical field of chip ball planting, in particular to a chip ball planting tool and a method thereof based on a computer complete machine manufacturing process. Background technique [0002] The computer manufacturing industry is an industry that produces various computer systems, peripheral equipment, terminal equipment, and other related devices. Together with the computer service industry, it constitutes the computer industry. Generally, computer accessories are manufactured separately and then assembled. [0003] Some DIY enthusiasts will buy computer components and assemble them by themselves. This computer assembly method is a test of the user's hands-on ability, especially the BGA chip on the computer motherboard. When there is a soldering error or a later circuit board failure It is necessary to disassemble the BGA chip every time, which will easily lead to the loss of the solder balls on the BGA chip, and the bal...

AI Technical Summary

Problems solved by technology

[0003] Some DIY enthusiasts will buy computer components and assemble them by themselves. This computer assembly method is a test of the user's hands-on ability, especially the BGA chip on the computer motherboard. When there is a soldering error or a later circuit board failure It is necessary to disassemble the BGA chip every time, which will easily lead to the loss of the solder balls on the BGA chip, and the ball needs to be re-planted. Due to the lack of special chip ball planting tools, the process of manual ball planting by the user is slow and complicated, and it is easy to cause chip scratches and damage. The collision caused the chip to be scrapped, and at the same time affected the uniformity after ball planting and the later welding strength, which brought troubles to users

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