A dual-fiber matrix coupling chip device

A dual optical fiber and chip technology, applied in the coupling of optical waveguide, optics, light guide, etc., can solve the problems of no coupling device and equipment, failure to effectively detect the proximity state, fragmentation of FA and CHIP, etc., and achieve the realization of the proximity state The effect of monitoring
CN114077022BActive Publication Date: 2022-07-29QXP TECH INC
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
QXP TECH INC
Publication Date
2022-07-29

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Abstract

The invention provides a dual-fiber matrix coupling chip device, which relates to the field of optoelectronic technology. It includes: a chip fixing mechanism, which is used for fixing the planar waveguide chip; a first FA clamping mechanism, which is arranged on one side of the chip fixing mechanism and used for clamping the first FA with pigtail; the second FA clamping mechanism A mechanism, which is arranged on the other side of the chip fixing mechanism, is used to clamp the second FA with pigtails; the bottom of the first FA clamping mechanism and the second FA clamping mechanism and the electric adjustment platform A first bonding force detection member and a second bonding force detection member are respectively arranged between them. The invention realizes FA+CHIP+FA and has the coupling function of the tail product of FIBERTURNINGBLOC; realizes the proximity state monitoring between FA and CHIP; couples the PD at the tail (in the case that the sensor has a load limit and an external dimension is limited) The adjustment function of multiple positions is realized.
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Description

technical field

[0001] The invention relates to the field of optoelectronic technology, in particular to a dual-fiber matrix coupling chip device. Background technique

[0002] At present, the combination between FA (fiber matrix) and a light source on a single PCBA (printed circuit board assembly) or a single CHIP (chip) is a conventional product, and there is no FA+CHIP+FA with FIBER TURNING BLOC. (Jumper steering buckle), so there is no coupling device and equipment that can realize this function.

[0003] And the existing FA and CHIP coupling device, the conventional solution is that the single FA tail is connected to the jumper through the ceramic ferrule and then directly coupled with the CHIP, the close state of the FA and the CHIP between the coupling processes (the strength detection after bonding) fails. Effective detection makes it difficult to achieve effective coupling, especially when the coupling needs to be close, and the force is too large, which will break...

Claims

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