Method for improving hot melting thickness uniformity of PCB

Abstract

The embodiment of the invention discloses a method for improving the hot melting thickness uniformity of a PCB. The method comprises the steps of: preparing substrates and prepregs to be fused, enabling the substrates and the prepregs to be alternately overlapped to obtain a to-be-fused PCB, enabling hot melting blocks of a copper grid structure to be disposed between the substrates and the prepregs of the to-be-fused PCB, putting the to-be-fused PCB with the hot melting blocks on a processing platform of a hot melting machine, starting the hot melting machine to heat the hot melting blocks, and pressing the to-be-fused PCB to obtain a fused PCB. The hot melting blocks of a copper grid structure are arranged between the substrates and the prepregs of the to-be-fused PCB, and the to-be-fused PCB is heated and pressed, so that the hot melting block area is heated uniformly, the produced PCB is uniform in thickness and not easy to wrinkle, and the probability of scrapping of the PCB is reduced.

Description

technical field [0001] The invention relates to the technical field of PCB printed circuit board production, in particular to a method for improving the uniformity of thermal melting thickness of a PCB board. Background technique [0002] In the lamination production process of the PCB (Printed Circuit Board) board to be fused, it is necessary to overlap the prepreg and the substrate to form the PCB board to be fused, and set a hot melt block on the edge of the board, and the hot melt machine Through the contact between the hot-melt chuck and the heating sheet and the surface of the hot-melt block, the heated hot-melt block makes the prepreg gel and fuse with the substrate. During the heating process, due to the influence of the heat accumulation of the plate, the prepreg and the substrate are repeated Fast heat transfer will increase its glue flow or cause temperature instability, resulting in uneven heating in the area of ​​the hot melt block, resulting in uneven thickness...

AI Technical Summary

Problems solved by technology

[0002] In the lamination production process of the PCB (Printed Circuit Board) board to be fused, it is necessary to overlap the prepreg and the substrate to form the PCB board to be fused, and set a hot melt block on the edge of the board, and the hot melt machine Through the contact between the hot-melt chuck and the heating sheet and the surface of the hot-melt block, the heated hot-melt block makes the prepreg gel and fuse with the substrate. During the heating process, due to the influence of the heat accumulation of the plate, the prepreg and the substrate are repeated Fast heat transfer will increase its glue flow or cause temperature instability, resulting in uneven heating in the area of ​​the hot melt block, resulting in uneven thickness. This area will form a height difference, and the fluidity of the edge glue during pressing is not good. , forming wrinkles, increasing the probability of PCB board scrapping

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