Ceramic substrate wax-sticking cutting process
A ceramic substrate and cutting process technology, applied in manufacturing tools, metal processing equipment, welding equipment, etc., can solve the problems of uneven end surface, difficult cleaning, small size, etc., to improve product yield, large sticking area, and production quality. high effect
Pending Publication Date: 2022-03-01
浙江美迪凯光学半导体有限公司
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Problems solved by technology
[0002] The original ceramic substrate cutting process is to paste the ceramic substrate on the UV film, and then perform laser cutting. After cutting, the UV film is removed. Due to the strong viscosity of the UV film, after the UV film is removed, the ceramic substrate touches the UV film. There is still some glue left on one side, which is difficult to clean, and because the ceramic substrate product contains metal, if it is cleaned with an alkaline cleaning agent, corrosion will occur, and the residual glue on the surface of the product cannot be cleaned, resulting in the product being scrapped, and the yield rate is very high Low, increased processing costs
[0003] Moreover, the size of the ceramic substrate is small after cutting, and the UV film will be stretched and deformed during the cutting process when pasted on the UV film, resulting in uneven end faces after cutting
Method used
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Embodiment
[0032] Embodiment: a kind of ceramic substrate sticking wax cutting process, its steps are:
[0033] S1. Set the fixture for clamping the ceramic substrate and the protective glass. The fixture includes a cover plate and a bottom plate. Place the cover plate and the bottom plate on the heating plate to heat, and place the protective glass on the bottom plate to heat. The temperature is controlled at 70°C-90°C ℃;
[0034] S2. Apply wax evenly on the protective glass, and place the ceramic substrate on the waxed protective glass;
[0035] S3. Press the heated cover plate onto the ceramic substrate on the protective glass, press the ceramic substrate and the protective glass, and press a heavy object on the cover plate, and let it stand for 10 minutes to obtain a wax-bonded Ceramic substrate and protective glass;
[0036] S4. Take out the bonded ceramic substrate and protective glass, and paste the side with protective glass on the UV film;
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The invention discloses a wax-sticking cutting process for a ceramic substrate. According to the sticky wax cutting process for the ceramic substrate, a protective glass medium is placed between the ceramic substrate and the UV film through sticky wax, the protective glass and the ceramic substrate are separated for wax removal, no residue is left, meanwhile, only a non-corrosive cleaning agent is needed for cleaning the protective glass and the ceramic substrate, a product can be cleaned up, the production quality is high, and the production cost is low. And the product yield can be effectively improved.
Description
technical field [0001] The invention relates to the technical field of cutting ceramic substrates, in particular to a wax-sticking cutting process for ceramic substrates. Background technique [0002] The original ceramic substrate cutting process is to paste the ceramic substrate on the UV film, and then perform laser cutting. After cutting, the UV film is removed. Due to the strong viscosity of the UV film, after the UV film is removed, the ceramic substrate touches the UV film. There is still some glue left on one side, which is difficult to clean, and because the ceramic substrate product contains metal, if it is cleaned with an alkaline cleaning agent, corrosion will occur, and the residual glue on the surface of the product cannot be cleaned, resulting in the product being scrapped, and the yield rate is very high Low, increased processing costs. [0003] Moreover, the size of the ceramic substrate is small after cutting, and the UV film will be stretched and deformed...
Claims
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IPC IPC(8): B23K26/60B23K26/38B23K26/402B23K26/70
CPCB23K26/60B23K26/38B23K26/402B23K26/702
Inventor 韩巍巍韩威风管文杰蔡东方郭泽远孔相朝钮云飞
Owner 浙江美迪凯光学半导体有限公司