Wafer box device, machine table and wafer detection method

A detection method and wafer box technology, applied in the field of semiconductor technology, can solve the problems of reduced yield rate of semiconductor products, failure to identify in time, and time-consuming problems, so as to achieve simple structure, avoid adverse effects, and save time for downtime and maintenance Effect

Pending Publication Date: 2022-03-01
ADVANCED MICRO FAB EQUIP INC CHINA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

A normal silicon wafer is often not recognized in time due to the reduction in thickness or weight caused by long-term cleaning and etching
When the thickness of the wafer is below a certain threshold, it is easy to cause the wafer to break during the mechanical transfer process
Damaged wafers will pollute the subsequent process flow, greatly reducing the yield of semiconductor products
And once the process is abnormal or fails, the process machine must be shut down for maintenance, and it will take a lot of time to detect which wafer is scrapped, and the entire production time will also be delayed

Method used

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  • Wafer box device, machine table and wafer detection method
  • Wafer box device, machine table and wafer detection method
  • Wafer box device, machine table and wafer detection method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0077] Such as Figure 4 As shown, in this embodiment, the sensor 3 is a quality sensor 31 for measuring the quality of the wafer. First, a maximum weight threshold and a minimum weight threshold matching the process performed by the machine are input through the input unit 5 . The threshold range=[minimum weight threshold, maximum weight threshold]. When a wafer 7 is processed, the wafer loading and unloading machine 63 opens the door of the wafer cassette body 1, and the wafer 7 is transferred to the carrier bar 2 in the wafer cassette body, and the wafer loading and unloading machine 63 closes the wafer cassette. The opening of the main body 1 is weighed by at least three mass sensors 31 arranged on the carrying bar 2 . The weighing result of each mass sensor 31 will be displayed on the outer surface of the wafer cassette body through the display unit 61 . Normally, the weighing result of each mass sensor 31 is one-third of the mass of the wafer 7 . When there is a weig...

Embodiment 2

[0080] In this embodiment, the weight of the wafer 7 is still used to determine whether the wafer 7 has defects. Such as Figure 5 As shown, the sensor 3 used in this embodiment is a displacement sensor 32, the wafer 7 is supported by the displacement sensor 32, and a corresponding deformation value is generated according to the elastic deformation of the weight of the wafer 7; the judging unit 4 is based on the elastic deformation The degree to obtain the weight of the wafer 7 .

[0081] Such as Image 6 As shown, the bottom of the displacement sensor 32 can be adjusted up and down, so that the top of the displacement sensor 32 disposed on the same carrier bar is at the same level, and the weighing value of the wafer 7 can be obtained more accurately.

Embodiment 3

[0083] In this embodiment, whether there is a defect is judged by detecting the thickness of the wafer 7 . The sensor 3 used in this embodiment is a photosensitive sensor 33 . Such as Figure 7 , Figure 8 As shown, the photosensitive sensor 33 is arranged between two vertically adjacent carrying bars 2 . The photosensitive sensor 33 includes an emitting portion 331 and a carrying portion 332 . The carrier part 332 is used to place the wafer, and it is arranged on the top surface of the lower carrier bar 2 among the two adjacent carrier bars 2 up and down; the carrier part 332 can be adjusted up and down so that it is arranged on the same carrier bar. The top ends of the carrying parts 332 of 2 are located on the same horizontal plane; the launching part 331 is arranged on the bottom surface of the upper carrying bar 2 among the two adjacent carrying bars 2 up and down; the launching part 331 emits to the wafer 7 below it. light beam, and generate a distance value accordin...

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PUM

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Abstract

The invention provides a wafer box device, which comprises a wafer box body with a closed hollow structure; a plurality of bearing strips are arranged on the inner side wall of the wafer box body at intervals from top to bottom, and the plurality of bearing strips with the same height are used for bearing wafers; the sensor is arranged on the bearing strip and is used for acquiring a characteristic value of the wafer; and the judgment unit is arranged on the wafer box body and is used for judging whether the characteristic value is within a threshold range or not according to the characteristic value acquired by the sensor. The invention also provides a semiconductor processing machine and a wafer detection method. According to the invention, the abnormal condition of the wafer in the wafer box can be automatically identified in real time according to the thickness and weight of the wafer, the downtime rate of a machine is reduced, and the yield of the wafer is greatly improved.

Description

technical field [0001] The invention relates to the technical field of semiconductor technology, in particular to a wafer box device, a machine and a wafer detection method. Background technique [0002] The manufacturing process of semiconductor products needs to go through many process steps, and each process step is completed by the corresponding process machine. When a batch of wafers is completed on a process machine, the robotic arm (Arm) of the process machine will put the batch of wafers into the wafer box (Foup), and then the operator will remove the wafer box from the process The machine is moved to the storage system, and then the wafer box is transferred to the next process machine through the storage system and the transportation system, and the robot arm of the next process machine takes the wafer out of the wafer box and transfers it to the process reaction The process reaction is carried out in the room, and the wafer is returned after the process reaction i...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/673H01L21/677H01L21/67H01L21/66
CPCH01L21/6735H01L21/6773H01L21/67288H01L22/20
Inventor 赵军苏兴才王晓雯王乔慈
Owner ADVANCED MICRO FAB EQUIP INC CHINA
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