Radiator for power electronic equipment

Abstract

The invention discloses a radiator for power electronic equipment. The radiator comprises a shell, an opening group, a pipe body group and a filling pipe, the shell comprises a cover plate and a bottom plate, the cover plate and the bottom plate are combined, and a cavity is formed in the shell. A first capillary structure and a second capillary structure are arranged in the cavity. The at least one hole group is located on the cover plate. Each open pore group comprises a first open pore and an odd number of second open pores. And the pipe body groups are in one-to-one correspondence with the opening groups. The number of the pipe bodies in the pipe body sets is half of the sum of the number of the first open holes and the number of the second open holes in the open hole sets where the pipe bodies are located, each pipe body is provided with two ports, in the same pipe body set, the two ports of one pipe body are communicated with one first open hole and one second open hole of the corresponding open hole set where the pipe body is located, and the two ports of the other pipe bodies are communicated with the two second open holes of the corresponding open hole set where the pipe body is located. The radiator for the power electronic equipment is high in radiating efficiency and particularly suitable for the condition that a heat source is vertically or obliquely installed.

Description

technical field [0001] The invention belongs to the technical field of heat dissipation, and relates to a radiator for power electronic equipment. Background technique [0002] Air-cooled radiators are widely used in the field of power electronics cooling due to their simplicity, reliability, and low price. However, with the rapid development of industries such as big data, AI, and the Internet of Things, the power consumption of hardware integrated circuits is increasing, and the heat generation and heat flux density are also increasing. The heat dissipation capacity of traditional air-cooled radiators such as heat pipe radiators and vapor chambers is increasingly difficult to meet the demand. Especially when the heat source in the equipment is installed vertically or obliquely, the heat dissipation effect of the radiator will be affected and the performance will be reduced. Therefore, there is an urgent need for a more efficient and adaptable air-cooled radiator for elec...

AI Technical Summary

Problems solved by technology

[0003] In order to solve the problem of difficult heat dissipation of current power electronic equipment, this invention proposes a radiator, which has the advantages of large heat dissipation capacity, high efficiency, and strong adaptability, and is especially suitable for vertical or oblique installation of heat sources in power electronic equipment. Case

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