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Heat dissipation structure

A technology of heat dissipation structure and heat sink, applied in cooling/ventilation/heating transformation, modification by conduction heat transfer, transformer/inductor cooling, etc. Problems such as rising operating temperature and obstruction of cooling air ducts of power components to achieve high assembly density, high power density, and reduced board area

Active Publication Date: 2022-03-01
ZTE CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004]In electronic equipment, circuit boards integrate more and more data processing main chips and optical modules with higher power consumption. These devices not only It occupies a large amount of layout area in the length and width direction of the circuit board. For the height direction, the device needs to be backed with a thick heat sink to achieve heat dissipation. In this way, the height of a device with a heat sink can reach more than ten millimeters to tens of millimeters, which hinders the heat dissipation air ducts of the power components that are placed near the devices for power supply, resulting in poor heat dissipation of the power components, resulting in a passive increase in the operating temperature of the power components, which directly affects to the working efficiency, service life and reliability of power components

Method used

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0097] refer to image 3 , Figure 4 ,in, image 3 An exploded view of the inductor with an integral heat sink, Figure 4 It is an assembly diagram of an inductance with an integral heat sink, and the inductance, as the first type of heating component, includes: winding 11 and magnetic core 12; among them,

[0098] The magnetic core 12 is divided into two parts, the first part of the magnetic core 12 is adjacent to the heat sink 13, and the second part of the magnetic core 12 is adjacent to the circuit board. The second magnetic core 12 is divided into three sub-blocks, with windings 11 arranged between two sub-blocks, and two windings 11 arranged between the three sub-blocks.

[0099] The inductor is supported on the circuit board 14 through the winding 11 and has an overhead structure relative to the circuit board 14 .

[0100] The gap between the magnetic core 12 and the winding 11 of the inductor is filled with a flexible heat-conducting material. A flexible thermally...

Embodiment 2

[0104] refer to Figure 5 , Figure 6 ,in, Figure 5 An exploded view of the inductor with an integral toothed heat sink, Figure 6 It is an assembly diagram of an inductance with an integral toothed heat sink, and the inductance as a magnetic device includes: winding 11, magnetic core 12; wherein,

[0105] The magnetic core 12 is divided into two parts, the first part of the magnetic core 12 is adjacent to the heat sink 13, and the second part of the magnetic core 12 is adjacent to the circuit board. The second magnetic core 12 is divided into three sub-blocks, with windings 11 arranged between two sub-blocks, and two windings 11 arranged between the three sub-blocks.

[0106] The inductor is supported on the circuit board 14 through the winding 11 and has an overhead structure relative to the circuit board 14 .

[0107] The gap between the magnetic core 12 and the winding 11 of the inductor is filled with a flexible heat-conducting material. A flexible thermally conduct...

Embodiment 3

[0111] refer to Figure 7 , Figure 8 ,in, Figure 7 An exploded view of the inductor with two discrete toothed heat sinks, Figure 8 It is an assembly drawing of an inductor with two discrete toothed heat sinks, and the inductor as a magnetic device includes: a winding 11 and a magnetic core 12; wherein,

[0112] The magnetic core 12 is divided into two parts, the first part of the magnetic core 12 is adjacent to the heat sink 13, and the second part of the magnetic core 12 is adjacent to the circuit board. The second magnetic core 12 is divided into three sub-blocks, with windings 11 arranged between two sub-blocks, and two windings 11 arranged between the three sub-blocks.

[0113] The inductor is supported on the circuit board 14 through the winding 11 and has an overhead structure relative to the circuit board 14 .

[0114] The gap between the magnetic core 12 and the winding 11 of the inductor is filled with a flexible heat-conducting material. A flexible thermally ...

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Abstract

The invention discloses a heat dissipation structure. The heat dissipation structure comprises a heat dissipation device, a first type heating assembly and a second type heating assembly. The first type of heating assembly comprises a winding and a magnetic core, the second type of heating assembly comprises a heating device, and the heat dissipation device comprises a cooling fin and a circuit board with a heat conduction channel; wherein the winding is arranged between the magnetic cores, and the first type heating assembly is supported on the circuit board through the winding and is of an overhead structure relative to the circuit board; the cooling fin covers the outer surface of the first type of heating assembly, the cooling fin and the first type of heating assembly are of an integrated structure, and the height of the integrated structure is larger than or equal to a preset value; the bottom of the heating device is provided with a first bonding pad, and the first bonding pad is arranged on the circuit board; the radiating fin is welded on the circuit board through one or more welding terminals; the heat of the heating device is transmitted to the circuit board through the first bonding pad, and is transmitted to the cooling fin through the heat conduction channel on the circuit board.

Description

[0001] This application is a divisional application with the filing date of "2017.06.02", the application number of "201710409957.5", and the application name of "a heat dissipation structure". technical field [0002] The invention relates to heat dissipation technology of electronic devices, in particular to a heat dissipation structure. Background technique [0003] With the continuous increase in power and volume reduction of electronic equipment, the application space of each device in electronic equipment becomes more and more compact. High assembly density and high power density have become two important directions for the development of electronic equipment. [0004] In electronic equipment, the circuit board integrates more and more devices such as data processing main chips and optical modules with increasing power consumption. These devices not only occupy a large amount of layout area in the length and width direction of the circuit board , for the high directio...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20H01F27/08
CPCH05K7/2039H01F27/08H01F27/22
Inventor 张里根陈丽霞张滨
Owner ZTE CORP