Electrical test device and test method for cutting channel device

Abstract

The invention provides an electrical property testing device and testing method for a cutting channel device, which are used for monitoring whether electrical parameters of devices on a cutting channel reach the standard or not, and the device comprises a probe card which comprises a plurality of probes, one probe is electrically connected with one device and is used for testing the electrical property of the devices, the plurality of probes are electrically connected with a plurality of devices at the same time, and the probe card is used for testing the electrical property of the devices. The electrical property testing module is used for testing electrical properties of multiple devices simultaneously; and the test machine is connected with the probe card and is used for testing an algorithm and writing a test program so as to respectively control the plurality of probes to carry out electrical tests on the plurality of devices and obtain electrical parameters of the plurality of devices. The plurality of probes are controlled by a program to simultaneously carry out electrical test on the devices on the plurality of cutting channels to obtain the electrical parameters of the devices, so that the test time can be shortened, and meanwhile, the needle inserting frequency is reduced, so that the abrasion degree of the probes is reduced, and the service life of the probes is prolonged.

Description

technical field [0001] The invention relates to the field of semiconductor device testing, in particular to an electrical testing device and a testing method for dicing line devices. Background technique [0002] During the WAT test, the purpose of monitoring the electrical characteristics of the active and passive devices inside the chip is achieved by monitoring the devices on the dicing lane. Please refer to figure 1 , devices of various sizes will be set on the same cutting line, and pad111 communicating with the device 112 is set on the cutting line, for example, pad111 is connected to various devices 112 through VIA and CONT, and the position of the device 112 is located in the area between pad111, such as Place multiple PMOS tubes, PGOI or PBJT, and P / N type passive devices with different sizes but the same electrical thickness TOX. [0003] In the prior art, a testing machine, a test head 140 connected to the testing machine and a probe card 120 are used to conduct...

AI Technical Summary

Problems solved by technology

[0004] However, every time a device is tested, the electrical test method of each device may be different, and multiple devices require multiple test items, resulting in a longer test time

At the same time, the material of the needle head of the probe is special metals such as rhenium and tungsten. In order to reduce the influence of the residual charge on the needle tip of the probe card in some test items, the needle head of the probe card will be discharged twice, that is, the needle is inserted twice, and the number of grinding needles increases. The probe card will be gradually shortened, the length of the needle card will be shortened, and the needle head will become larger, which will shorten the life of the probe card. If one device is tested, the life of the probe card will be shortened more quickly

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