Unlock instant, AI-driven research and patent intelligence for your innovation.

Chip self-destruction device and use method thereof

A self-destructing device and chip technology, applied in the field of electronic information security, can solve problems such as fraudulent use of commodity information

Pending Publication Date: 2022-03-08
魏华明
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, with the extensive use of electronic tags, electronic tags that are discarded after the product is activated are often recycled by criminals for secondary use to make counterfeit products because they are not easy to self-destruct. product information for

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Chip self-destruction device and use method thereof
  • Chip self-destruction device and use method thereof
  • Chip self-destruction device and use method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0046] Such as Figure 4 As shown, on the basis of the above structure, the voltage detection circuit at least includes a diode D, the anode of the diode D is electrically connected to the anode of the piezoelectric ceramic mechanism, and the cathode of the diode D is electrically connected to the input terminal of the physical self-destruct circuit. The charge absorption circuit at least includes a capacitor C, one end of the capacitor C is electrically connected to the positive electrode of the piezoelectric ceramic mechanism, and the other end of the capacitor C is electrically connected to the negative electrode of the piezoelectric ceramic mechanism, and the breakdown voltage of the capacitor C is greater than the forward conduction of the diode D pressure drop. The pressure generating mechanism is a pressing part processed and formed by hard material.

[0047] In this embodiment, the present invention greatly simplifies the voltage detection circuit and the charge absor...

Embodiment 2

[0049] Such as Figure 5 As shown, a method of using a self-destructing device for a chip, the chip self-destructing device of any one of the above-mentioned devices is arranged in the bottle cap of the container bottle, and when the bottle cap is rotated to open, the pressure generating mechanism is driven by the rotating force to press the piezoelectric ceramic Bodies apply pressure to trigger self-destruct signals.

Embodiment 3

[0051] Such as Figure 6 As shown, a method of using a chip self-destruct device, the chip self-destruct device of any one of the above is arranged in the lock body of the container box, the pressure generating mechanism is arranged at the inner end of the unlock button of the container box, when the unlock button is squeezed When the lock body is opened, the pressure generating mechanism is driven by the pressing force of unlocking to exert pressure on the piezoelectric ceramic mechanism to trigger a self-destruct signal.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention belongs to the technical field of electronic information security, and particularly relates to a chip self-destruction device and a using method thereof.The device comprises a pressure generation mechanism, a piezoelectric ceramic mechanism, a voltage detection circuit, a charge absorption circuit and a chip with a physical self-destruction circuit, and the chip is internally provided with a data storage module and the physical self-destruction circuit; after the physical self-destruction circuit is electrically conducted, the data storage module is physically damaged, the pressure generation mechanism abuts against and is connected to the piezoelectric ceramic mechanism, and the positive electrode of the piezoelectric ceramic mechanism is electrically connected with the input end of the voltage detection circuit and one end of the charge absorption circuit. The negative electrode of the piezoelectric ceramic mechanism is electrically connected with the other end of the charge absorption circuit and the output end of the physical self-destruction circuit, and the voltage detection circuit is electrically connected with the positive electrode of the piezoelectric ceramic mechanism and the input end of the physical self-destruction circuit and used for conducting the physical self-destruction circuit when it is detected that the high voltage exceeds a threshold value. The charge absorption circuit is used for absorbing stray current or small voltage.

Description

technical field [0001] The invention belongs to the technical field of electronic information security, and in particular relates to a chip self-destruct device and a using method thereof. Background technique [0002] With the continuous improvement of customers' requirements for product quality, the anti-counterfeiting requirements for high-quality products are getting higher and higher. Counterfeit goods are becoming more and more rampant, leading to the flood of counterfeit and shoddy goods on the market. Brand manufacturers suffer greatly and suffer heavy losses. In the social environment, how to put an end to counterfeit goods is a top priority. [0003] In view of the increasingly rampant counterfeit goods, many anti-counterfeiting companies have also launched a series of anti-counterfeiting products. For example, for middle and high-end commodities such as tobacco and alcohol, medicine, health care products, luggage, etc., anti-counterfeiting is carried out by addi...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): G06K19/077G06K19/073G06F21/87H02N2/18
CPCG06K19/07726G06K19/073G06K19/07758G06F21/87H02N2/18
Inventor 魏华明
Owner 魏华明