Heat dissipation structure for POP packaging and construction method thereof

A heat dissipation structure and heat dissipation cover technology, which is applied in semiconductor/solid-state device manufacturing, electrical components, electric solid-state devices, etc., can solve problems such as chip failure, natural convection effect reduction, low thermal conductivity of the underlying substrate, etc., to ensure heat dissipation efficiency Effect

Pending Publication Date: 2022-03-11
NAT CENT FOR ADVANCED PACKAGING +1
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, in the traditional POP packaging structure, the heat generated by the operation of the second chip in the lower package can only be dissipated through the lower substrate and natural convection, but the thermal conductivity of the lower substrate is low, and the upper package will cause the effect of natural convection It is also greatly reduced, so the heat dissipation of the second chip is very unsatisfactory, and it is easy to fail because the chip temperature exceeds the allowable temperature during work.
In addition, although the first chip in the upper package can dissipate heat through an external heat dissipation cover and other heat dissipation devices, as the scale and power of the first chip continue to increase, the traditional heat dissipation devices also have insufficient heat dissipation effects. insufficient

Method used

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  • Heat dissipation structure for POP packaging and construction method thereof
  • Heat dissipation structure for POP packaging and construction method thereof
  • Heat dissipation structure for POP packaging and construction method thereof

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Embodiment Construction

[0037] It should be noted that components in the various figures may be shown exaggerated for the purpose of illustration and are not necessarily true to scale. In the various figures, identical or functionally identical components are assigned the same reference symbols.

[0038] In the present invention, unless otherwise specified, "arranged on", "arranged on" and "arranged on" do not exclude the presence of intermediates between the two. In addition, "arranged on or above" only means the relative positional relationship between two parts, and under certain circumstances, such as after the product direction is reversed, it can also be converted to "arranged under or below", and vice versa Of course.

[0039] In the present invention, each embodiment is only intended to illustrate the solutions of the present invention, and should not be construed as limiting.

[0040] In the present invention, unless otherwise specified, the quantifiers "a" and "an" do not exclude the scen...

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Abstract

The invention relates to the technical field of semiconductor packaging, and provides a heat dissipation structure for POP packaging and a construction method of the heat dissipation structure. The heat dissipation structure comprises a first substrate and a second substrate. A first chip disposed on the first substrate; a second chip disposed on the second substrate; and the micro-channel is connected with the first chip and the second chip and is used for leading out heat generated by working of the first chip and the second chip.

Description

technical field [0001] The present invention generally relates to the field of semiconductor packaging technology. Specifically, the present invention relates to a heat dissipation structure for POP packaging and a construction method thereof. Background technique [0002] For the semiconductor system level (System In a Package SIP) packaging, the package on package (POP) packaging process is very important. [0003] In the traditional POP packaging structure, an upper package body and a lower package body are usually included, and the upper package body and the lower package body respectively include a first chip and a second chip, and the upper package body and the lower package body pass through the copper core Balls enable support and interconnection. [0004] However, in the traditional POP packaging structure, the heat generated by the second chip in the lower package can only be dissipated through the lower substrate and natural convection, but the thermal conductiv...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/473H01L21/50
CPCH01L23/473H01L21/50
Inventor 周云燕陈海英陈钏苏梅英
Owner NAT CENT FOR ADVANCED PACKAGING
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