Heat dissipation structure for POP packaging and construction method thereof

Abstract

The invention relates to the technical field of semiconductor packaging, and provides a heat dissipation structure for POP packaging and a construction method of the heat dissipation structure. The heat dissipation structure comprises a first substrate and a second substrate. A first chip disposed on the first substrate; a second chip disposed on the second substrate; and the micro-channel is connected with the first chip and the second chip and is used for leading out heat generated by working of the first chip and the second chip.

Description

technical field [0001] The present invention generally relates to the field of semiconductor packaging technology. Specifically, the present invention relates to a heat dissipation structure for POP packaging and a construction method thereof. Background technique [0002] For the semiconductor system level (System In a Package SIP) packaging, the package on package (POP) packaging process is very important. [0003] In the traditional POP packaging structure, an upper package body and a lower package body are usually included, and the upper package body and the lower package body respectively include a first chip and a second chip, and the upper package body and the lower package body pass through the copper core Balls enable support and interconnection. [0004] However, in the traditional POP packaging structure, the heat generated by the second chip in the lower package can only be dissipated through the lower substrate and natural convection, but the thermal conductiv...

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Problems solved by technology

[0004] However, in the traditional POP packaging structure, the heat generated by the operation of the second chip in the lower package can only be dissipated through the lower substrate and natural convection, but the thermal conductivity of the lower substrate is low, and the upper package will cause the effect of natural convection It is also greatly reduced, so the heat dissipation of the second chip is very unsatisfactory, and it is easy to fail because the chip temperature exceeds the allowable temperature during work.

In addition, although the first chip in the upper package can dissipate heat through an external heat dissipation cover and other heat dissipation devices, as the scale and power of the first chip continue to increase, the traditional heat dissipation devices also have insufficient heat dissipation effects. insufficient

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