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Grinding robot device

A technology of robots and grinding belts, applied in the direction of grinding automatic control devices, grinding machine parts, grinding machines, etc., can solve the problem of inability to flexibly respond to semiconductor wafer types or various specifications, inability to ensure flexibility in use, and expansion to achieve the effect of ensuring expansion, improving grinding accuracy and ensuring flexibility

Pending Publication Date: 2022-03-15
SANSHIN KOGYO CO LTD
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Problems solved by technology

[0009] However, in the case of the above-mentioned conventional structure, for example, there is a disadvantage that it cannot flexibly respond to various types of workpieces such as semiconductor wafers, liquid crystal panels, glass plates, lenses, copper plates, printed circuit boards, optical filters, and stainless steel plates. Or various specifications, so it is not possible to ensure the flexibility and expansion of the use

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Embodiment Construction

[0038] Figure 1 to Figure 16 shows an embodiment example of the present invention, in this case, as figure 1, Figure 10 As shown, it roughly includes the articulated robot A, and the surface W to be polished, which is mounted on the front end of the articulated robot A and grinds the workpiece W. 1 The grinding unit B further includes a holding unit C capable of holding and releasing the workpiece W described above, and a synchronous control unit D for synchronously controlling the articulated robot A, the grinding unit B, and the holding unit C. In this case, the articulated robot A and the holder C are arranged to face the machine base 1 .

[0039] In this case, if figure 2 , Figure 4 , Figure 9 as well as Figure 10 As shown, the above-mentioned grinding unit B is equipped with: a grinding belt T, which grinds the surface W to be ground of the above-mentioned workpiece W 1 ;Belt conveyor B 1 , which continuously or intermittently conveys the grinding tape T; an...

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Abstract

The invention relates to a grinding robot device. According to the present invention, an end effector of a multi-joint robot is configured to use a polishing unit, so that it is possible to cope with a variety of types and to be more versatile than a dedicated machine, and to ensure flexibility and enlargement of use, and the polishing unit is provided with a belt conveyance mechanism and a crimping mechanism. Therefore, the to-be-processed object can be polished by pressing the polishing surface of the polishing belt against the to-be-polished surface of the to-be-processed object. The present invention is provided with: an articulated robot; a polishing unit that is attached to the tip of the articulated robot and that polishes a surface to be polished of the workpiece; and a synchronization control unit that synchronously controls the articulated robot and the polishing unit, the polishing unit including: a polishing belt that polishes a surface to be polished of the workpiece; a belt conveying mechanism which continuously or intermittently conveys the grinding belt; and a crimping mechanism that crimps the polishing surface of the polishing belt to the surface to be polished of the workpiece.

Description

technical field [0001] The present invention relates to a grinding robot device for grinding the surface of plate-shaped parts such as liquid crystal panels, glass plates, lenses, semiconductor wafers, copper plates, printed substrates, optical filters, stainless steel plates, and corner edges. used for chamfering. Background technique [0002] In the past, as a device for grinding such workpieces such as glass plates or semiconductor wafers, for example, a special-purpose machine with a structure is known: a substrate with a predetermined particle size such as aluminum oxide bonded to a base material such as a polyester film is used. Abrasive tape obtained by fixing abrasive grains. [0003] prior art literature [0004] patent documents [0005] Patent Document 1: Japanese Patent No. 6673965 [0006] Patent Document 2: Japanese Patent Application Laid-Open No. 11-99458 [0007] Patent Document 3: Japanese Patent Application Laid-Open No. 11-99459 Contents of the inv...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B21/00B24B21/22B24B21/18B24B51/00B24B41/06B24B41/00B25J11/00
CPCB24B21/004B24B21/22B24B21/18B24B51/00B24B41/06B24B41/005B25J11/0065
Inventor 细贝晃司汤本裕
Owner SANSHIN KOGYO CO LTD
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