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Hydrophilic polyester composition, grinding pad and preparation method

A hydrophilic and composition technology, applied in the field of grinding, can solve the problems of grinding and increase the difficulty, and achieve the effect of simplifying the cleaning process, improving the grinding effect and good hydrophilicity.

Pending Publication Date: 2022-03-18
INST OF MICROELECTRONICS CHINESE ACAD OF SCI +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When the polishing pad is used to grind devices made of hydrophobic materials, the typical application scenario is that when the polysilicon material is ground, organic matter is easily adsorbed on the surface of the ground polysilicon, which easily causes grinding defects and increases the follow-up process. Difficulty during cleaning

Method used

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Embodiment Construction

[0021] Hereinafter, embodiments of the present disclosure will be described. It should be understood, however, that these descriptions are exemplary only, and are not intended to limit the scope of the present disclosure. Also, in the following description, descriptions of well-known structures and techniques are omitted to avoid unnecessarily obscuring the concept of the present disclosure.

[0022] For purposes of clarity, certain details are exaggerated and certain details may have been omitted. The shapes of various regions and layers and the relative sizes and positional relationships between them are only exemplary, and may deviate due to manufacturing tolerances or technical limitations in practice, and those skilled in the art can additionally design according to actual needs. Regions / layers of different shapes, sizes, relative positions.

[0023] In the context of the present disclosure, when a layer / element is referred to as being "on" another layer / element, the la...

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PUM

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Abstract

The invention provides a hydrophilic polyester composition. The hydrophilic polyester composition comprises polyester with various carbon chain lengths, wherein the polyester is prepared by taking isocyanate, polyhydric alcohol and a hydrophilic functional material as raw materials. The invention further provides a grinding pad which comprises a grinding layer made of the hydrophilic polyester composition, and the hydrophilic polyester composition comprises polyesters which are prepared from isocyanate, polyhydric alcohols and hydrophilic functional materials and have various carbon chain lengths. The invention further provides a preparation method of the grinding pad. The preparation method comprises the following steps: synthesizing isocyanate, polyol and a hydrophilic functional material to obtain a prepolymer; subjecting the prepolymer to polymerization so as to form a hydrophilic polyester composition; the hydrophilic polyester composition is molded in a mold to form the polishing pad. According to the invention, the surface of the grinding pad has higher hydrophilic property, and the grinding effect is improved.

Description

technical field [0001] The invention relates to the technical field of grinding, in particular to a hydrophilic polyester composition, a grinding pad and a preparation method. Background technique [0002] As the integration level of semiconductor devices increases, planarization becomes very important, and chemical mechanical polishing is usually used for planarization manufacturing technology. The chemical mechanical polishing method is a technique in which the device is mechanically and chemically polished on a polishing pad together with a polishing agent. Existing abrasive pads are usually made of polyurethane, which is both hydrophobic and hydrophilic due to its inherent characteristics. This is because during the preparation process of polyurethane, a chemical chain structure is formed by carboxyl groups (COO-) with hydrophilic characteristics and methyl groups (CH2-, CH3-) with hydrophobic characteristics; that is, prepolymers. A part of the hardener is added to th...

Claims

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Application Information

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IPC IPC(8): C08G63/685B24B37/11B24B37/24B24D18/00
CPCC08G63/685B24B37/11B24B37/24B24D18/0009
Inventor 李善雄杨涛张月
Owner INST OF MICROELECTRONICS CHINESE ACAD OF SCI