Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Micro-disk modulator

A modulator and microdisk technology, applied in the fields of instruments, nonlinear optics, optics, etc., can solve the problems of comprehensive performance gap, unable to meet the future development requirements of optical interconnection and optical communication, etc., to reduce the preparation cost, simple structure, and improve modulation The effect of efficiency

Pending Publication Date: 2022-03-22
WUHAN OPTICAL VALLEY INFORMATION OPTOELECTRONICS INNOVATION CENT CO LTD
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] At present, a variety of silicon-based electro-optic modulators have been successfully designed and manufactured, and various technical indicators have been gradually improved, but there is still a certain gap in overall performance compared with mature lithium niobate electro-optic modulators, which cannot meet Future development requirements of optical interconnection and optical communication

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Micro-disk modulator
  • Micro-disk modulator
  • Micro-disk modulator

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0025] The technical solutions of the present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments.

[0026] In the description of the present invention, it should be understood that the orientation or positional relationship indicated by the terms "length", "width", "depth", "upper", "lower", "outer" etc. are based on those shown in the accompanying drawings. Orientation or positional relationship is only for the convenience of describing the present invention and simplifying the description, and does not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation of the present invention.

[0027] In embodiments of the present invention, the term "substrate" refers to a material on which subsequent layers of material are added. The substrate itself can be patterned. The mater...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The micro-disk modulator provided by the embodiment of the invention comprises a substrate layer; the slab waveguide layer is positioned on the substrate layer; the coupling waveguide and the micro-disc resonance structure are arranged in the slab waveguide layer in parallel, the micro-disc resonance structure comprises a first doping structure and a second doping structure which are sequentially arranged in a stacked mode in the thickness direction of the substrate layer, and the doping type of the first doping structure is opposite to that of the second doping structure; the projection of the second doping structure on a preset plane is circular, and the preset plane is perpendicular to the thickness direction of the substrate layer; and an electrode electrically connected with the micro-disk resonant structure.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to a microdisk modulator. Background technique [0002] Drawing on the development route of large-scale integrated circuits, research is being carried out at home and abroad to integrate active devices (such as modulators, detectors, etc.) and optical waveguide devices (such as optical splitters / condensers, etc.) A photonic integrated chip with LSI-like advantages. Photonic integrated chips have the characteristics of low cost, small size, low power consumption, flexible expansion and high reliability. In the process of optical fiber communication, the intensity of light can be controlled by the electro-optic modulator, so the electro-optic modulator occupies an important position in the optical fiber communication system. At the same time, the electro-optic modulator is also one of the important optoelectronic devices in the photonic integrated chip solution. [0003] In ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): G02F1/015G02F1/025
CPCG02F1/0152G02F1/025
Inventor 张宇光肖希王磊胡晓陈代高
Owner WUHAN OPTICAL VALLEY INFORMATION OPTOELECTRONICS INNOVATION CENT CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com