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Wet chemical treatment equipment for printed circuit board

A board wet chemistry and printed circuit technology, which is applied in the field of printed circuit board processing, can solve the problems that the processing liquid is inconvenient for uniform contact with the circuit board, inconvenient circulation operation, inconvenient rapid treatment of bubbles and effusion, etc., to reduce labor costs The effect of reducing the cost, reducing the time spent, and reducing the occupied area

Active Publication Date: 2022-03-22
东莞塘厦裕华电路板有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to provide a printed circuit board wet chemical treatment equipment to solve the above background technology. The existing wet chemical treatment equipment is inconvenient to carry out continuous cycle operation in a small space, and it is inconvenient to treat air bubbles and effusion. Perform rapid processing, and the added processing liquid is inconvenient to contact the circuit board evenly

Method used

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  • Wet chemical treatment equipment for printed circuit board
  • Wet chemical treatment equipment for printed circuit board
  • Wet chemical treatment equipment for printed circuit board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0038] see Figure 1-3 , including a frame 1, a top cover 2 is installed on the top of the frame 1, and a processing chamber 3 is opened on the upper end surface of the frame 1, and a partition plate 301 is arranged between the processing chambers 3; it also includes: a first motor 4 , the first motor 4 is fixed on the bottom of the frame 1, and the output end of the first motor 4 is connected with a guide post 5, and the guide post 5 is located in the movable groove 6, and the movable groove 6 is opened in the middle part of the top of the frame 1, Guide column 5 is provided with movable column 7, and the outside of movable column 7 is fixed with guide bar 8, and guide bar 8 is positioned at guide groove 9, and guide groove 9 is offered on the inwall of movable groove 6, and the outer side of movable column 7 The top is located above the frame 1, and the side of the movable column 7 is fixed with a mounting plate 10, and the inside of the movable column 7 top is embedded with...

Embodiment 2

[0040] see Figure 1-2 , 4-6 and Figure 9 , the replacement slot 17, the replacement slot 17 is opened at the bottom of the mounting plate 10, and the first splint 18 and the second splint 19 with a "T" shape structure on the front are installed in the replacement slot 17, the first splint 18 and the second splint One end of clamping plate 19 is positioned at the below of mounting plate 10, and the inboard of first clamping plate 18 and the bottom of second clamping plate 19 are all connected with clip 21 by fixed spring 20, and the side of first clamping plate 18 and second clamping plate 19 and replacement The corresponding position of the inner wall of the slot 17 is fixed with a magnetic sheet 22, and the bottom edge of the mounting plate 10 is provided with an inner slot 23, and the inner slot 23 is fitted with a mounting strip 24 with a "T"-shaped structure on the front, and an adjusting plate 15 The bottom of the bottom is respectively fixed with a push rod 25 and a c...

Embodiment 3

[0042] see Figure 1-3 with Figure 7-8, the collection tank 38, the collection tank 38 is opened on the top of the dividing plate 301, and the collection bucket 39 is fixed on the inner wall of the collection tank 38, and the bottom of the collection bucket 39 is connected with the air collection pipe 40, and one end of the air collection pipe 40 is connected through the There is a gas collecting ring 41, the top of the gas collecting ring 41 is connected to the output end of the second air pump 42, and the second air pump 42 is fixed at the bottom of the frame 1, and the collecting tank 38 is connected with a sealing plate 382 through a support spring 381 , and the bottom of the collecting tank 38 is fixed with a pressure sensor 383, and the top of the sealing plate 382 is located above the partition plate 301, the top of the sealing plate 382 is designed in an isosceles trapezoidal structure, and the sides of the sealing plate 382 top are in line with the collecting tank T...

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Abstract

The invention discloses wet chemical treatment equipment for a printed circuit board. The wet chemical treatment equipment comprises a rack, and a top cover is mounted at the top of the rack; the device further comprises a first motor, the first motor is fixed to the bottom of the rack, a guide column is sleeved with a movable column, the top of the movable column is located above the rack, a second motor is installed in the top of the movable column in an embedded mode, the protruding position of the top of a gear is sleeved with a push strip, and an adjusting plate is located in an adjusting groove. The replacement groove is formed in the bottom of the mounting plate, one end of the first clamping plate and one end of the second clamping plate are located below the mounting plate, an inner groove is formed in the edge of the bottom of the mounting plate, a movable ejector rod is connected to one side of a transverse plate through a rotating shaft, and a spoiler is connected to a cavity in the bottom of a mounting strip through a reset spring. According to the wet chemical treatment equipment for the printed circuit board, continuous operation can be carried out, occupied space is reduced, and meanwhile uniformity and efficiency are improved during deposition.

Description

technical field [0001] The invention relates to the technical field of printed circuit board processing, in particular to wet chemical processing equipment for printed circuit boards. Background technique [0002] When the printed circuit board is processed, it is usually necessary to use wet chemical treatment methods for chemical deposition and protection on the surface of the printed circuit board, including pre-treatment, deposition preparation and post-treatment, in the deposition preparation, including activation → water washing → chemical nickel deposition → Water washing → chemical immersion gold → water washing and other processes can form a layer of protection on the surface of the circuit board, but the existing wet chemical processing equipment has the following problems during processing: [0003] Most of the existing wet chemical treatment equipment adopts step-by-step operation when performing deposition treatment, but it takes up a large space, and the deposi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/00H05K3/24
CPCH05K3/0085H05K3/24Y02P70/50
Inventor 李大鹏黄本顺
Owner 东莞塘厦裕华电路板有限公司
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