Unlock instant, AI-driven research and patent intelligence for your innovation.

Wafer cleaning equipment

A technology for cleaning equipment and wafers, used in cleaning methods and utensils, cleaning methods using liquids, electrical components, etc.

Pending Publication Date: 2022-03-25
ICLEAGUE TECH CO LTD
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, there are still many problems in the wafer cleaning equipment after the existing wafer is planarized

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Wafer cleaning equipment
  • Wafer cleaning equipment
  • Wafer cleaning equipment

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0029] As mentioned in the background art, there are still many problems in the existing wafer cleaning equipment after the wafer is planarized. It will be specifically described below.

[0030] Optical sensors are used in existing wafer cleaning equipment to monitor the position of the wafer and the height of the cleaning liquid. The optical sensor is installed in the middle of both sides of the box, and the light source of the photoelectric sensor emits light beams. When there is no wafer in the box, the light beams can be received by the receiving end of the photoelectric sensor on the other side. When there are wafers in the box, the beam is blocked by the wafer, and the receiving end of the photoelectric sensor on the other side cannot receive the beam, so as to achieve the effect of monitoring the presence or absence of wafers.

[0031] However, since the optical sensor causes light-induced corrosion of the metal, for wafer cleaning after metal CMP, the optical sensor i...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

A wafer cleaning device comprises a box body used for containing cleaning liquid and a wafer; the vibrating plate is arranged in the box body; the driving assembly is installed in the box body and used for driving the wafer to rotate in the wafer cleaning process; the piezoelectric assembly is connected with the driving assembly and is used for acquiring a pressure signal from the driving assembly; and the floating ball liquid level monitoring assembly is communicated with the box body and is used for monitoring the liquid level of the cleaning liquid. The corresponding monitoring assembly is formed through the mechanics principle, the wafer position and the liquid level height can be effectively monitored, and corrosion of the surface of the wafer after metal planarization during monitoring through optics, magnetic fields and electric fields is avoided.

Description

technical field [0001] The invention relates to the technical field of semiconductor manufacturing, in particular to a wafer cleaning device. Background technique [0002] Chemical Mechanical Planarization (CMP) equipment is one of the seven key equipment in the field of integrated circuit manufacturing. After the wafer is processed by CMP, the processed removal and polishing fluid will remain on the wafer surface. In order to remove the pollutants on the wafer surface in time, CMP equipment needs to be used with wafer cleaning equipment. [0003] However, there are still many problems in the existing wafer cleaning equipment after the wafer is planarized. Contents of the invention [0004] The technical problem solved by the present invention is to provide a wafer cleaning device to avoid corrosion on the wafer surface after the metal is flattened when optical, magnetic and electric field monitoring is used. [0005] In order to solve the above problems, the technical s...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H01L21/67B08B3/08B08B3/12
CPCH01L21/67057H01L21/67253B08B3/12B08B3/08
Inventor 邢程武敬勋孙鹏
Owner ICLEAGUE TECH CO LTD