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Member for semiconductor manufacturing apparatus

A technology for manufacturing devices and semiconductors, which is applied in the field of components for semiconductor manufacturing devices, and can solve problems such as hot spots and difficult ceramic plates

Pending Publication Date: 2022-03-25
NGK INSULATORS LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, it is difficult to generate hot spots on the ceramic board

Method used

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  • Member for semiconductor manufacturing apparatus
  • Member for semiconductor manufacturing apparatus
  • Member for semiconductor manufacturing apparatus

Examples

Experimental program
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Embodiment Construction

[0029] Next, preferred embodiments of the present invention will be described below with reference to the accompanying drawings. figure 1 It is a longitudinal cross-sectional view of the ceramic heater 10 .

[0030] It should be noted that, in this specification, "up" and "down" do not represent an absolute positional relationship, but a relative positional relationship. Therefore, depending on the orientation of the ceramic heater 10, "up" and "down" also become "down", "up", or "left", "right", or "front" and "rear".

[0031] The ceramic heater 10 is one of the components for a semiconductor manufacturing apparatus. The ceramic heater 10 is used to support and heat a wafer subjected to plasma treatment such as CVD and etching, and is installed inside a chamber for a semiconductor process (not shown). The ceramic heater 10 includes a ceramic plate 12 , a ceramic shaft 20 , a heating rod 24 , an RF connector 30 , and an RF link member 40 .

[0032] The ceramic plate 12 is a...

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PUM

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Abstract

A member for a semiconductor manufacturing apparatus according to the present invention has a structure in which a hollow ceramic shaft is provided on the rear surface of a ceramic plate, the front surface of which is a wafer mounting surface. The member for a semiconductor manufacturing apparatus includes an RF electrode embedded in a ceramic plate, an RF connector disposed on an outer side of a hollow interior of a ceramic shaft, and an RF link member provided between the RF connector and the RF electrode. The RF link member has a branch portion composed of a plurality of RF rods, and the branch portion extends to the outside of the ceramic shaft.

Description

technical field [0001] The present invention relates to a member for a semiconductor manufacturing apparatus. Background technique [0002] In semiconductor manufacturing apparatuses such as etching apparatuses and CVD apparatuses, members for semiconductor manufacturing apparatuses having a structure in which a cylindrical ceramic shaft is connected to the back surface of a disc-shaped ceramic plate whose surface is a wafer mounting surface are sometimes used. As such a member for a semiconductor manufacturing apparatus, there is known a member in which a high-frequency electrode (RF electrode) is embedded in a ceramic plate and plasma is generated by the RF electrode. For example, in the member for a semiconductor manufacturing apparatus of Patent Document 1, a plurality of RF rods are connected to the RF electrodes, and the plurality of RF rods are branched from a single RF connector arranged in the hollow interior of the ceramic shaft. In Patent Document 1, since a plur...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/683H01L21/3065C23C16/509C23C16/458H05B3/74
CPCH01L21/6833H01L21/3065H05B3/74C23C16/509C23C16/4581C23C16/46H01J37/32724H01L21/67103H05B2203/016H05B3/283H01L21/68792H01L21/68757H05B3/748H01L21/67069H01J37/32577C23C16/4586H01J2237/2007
Inventor 田村隆二
Owner NGK INSULATORS LTD
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