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Semiconductor wafer detection device and method and wafer cleaning system

A detection device and detection method technology, applied in semiconductor/solid-state device testing/measurement, semiconductor/solid-state device manufacturing, electrical components, etc., can solve problems such as delay in production capacity, equipment shutdown, wafer debris, etc.

Pending Publication Date: 2022-03-29
INST OF MICROELECTRONICS CHINESE ACAD OF SCI +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

During the cleaning process of the wafer, if the wafer is damaged and not detected in time, there will be wafer debris in the cleaning tank, which will affect the damage of the next batch of wafers entering the chemical tank, resulting in contamination of the wafer and The problem of equipment downtime seriously delays production capacity

Method used

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  • Semiconductor wafer detection device and method and wafer cleaning system
  • Semiconductor wafer detection device and method and wafer cleaning system
  • Semiconductor wafer detection device and method and wafer cleaning system

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Embodiment Construction

[0023] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0024] It should be noted that when an element is referred to as being “fixed” or “disposed on” another element, it may be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0025] In addition, the terms "first" and "second" are used for descriptive purposes only, and cannot be interpreted as indicating or implying relative importance or implicitly specifying the quantity of indic...

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Abstract

The invention discloses a semiconductor wafer detection device and method and a wafer cleaning system, relates to the technical field of semiconductor equipment, and aims to solve the problems of wafer pollution and equipment shutdown caused by the fact that wafer damage is not detected in time in the wafer cleaning process. The semiconductor wafer detection device comprises an automatic clamping mechanism; the image sensor is arranged on the automatic clamping mechanism, and the controller communicates with the image sensor. The semiconductor wafer detection method comprises the following steps: receiving a wafer image transmitted by the image sensor, and controlling the wafer cleaning equipment to stop under the condition of determining that the wafer is damaged according to the wafer image and a wafer initial image. The semiconductor wafer detection device provided by the invention is used for detecting the wafer damage state in a semiconductor cleaning process and preventing the influence of wafer damage on productivity.

Description

technical field [0001] The invention relates to the technical field of semiconductor equipment, in particular to a semiconductor wafer inspection device, method and wafer cleaning system. Background technique [0002] Wafers need to be cleaned in the semiconductor manufacturing process because the contaminants on the wafer surface can affect the performance of the device. Wafer cleaning is required to remove contaminants without damaging the wafer. Wafer cleaning equipment is required to clean the wafer. [0003] figure 1 It is a schematic structural diagram of wafer cleaning equipment in the prior art. Such as figure 1 As shown, the existing wafer cleaning equipment includes several process tanks. During the cleaning process, the wafer handling robot grabs the wafer and puts it into the process tank for cleaning. During the cleaning process of the wafer, if the wafer is damaged and not detected in time, there will be wafer debris in the cleaning tank, which will affect...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/66H01L21/67
CPCH01L22/12H01L21/6704
Inventor 慎吉晟胡艳鹏卢一泓李琳
Owner INST OF MICROELECTRONICS CHINESE ACAD OF SCI
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