Integrated liquid cooling chip radiator filled with three-period extremely-small curved surface and manufacturing method of integrated liquid cooling chip radiator

A very small curved surface, three-period technology, applied in semiconductor/solid-state device manufacturing, electric solid-state devices, semiconductor devices, etc., can solve the problem that liquid-cooled heat sinks are difficult to meet the needs of heat sinks and liquid efficient heat transfer, and eliminate local hot spots. , The heat transfer is uniform and rapid, and the effect of strengthening the convective heat transfer effect

Pending Publication Date: 2022-03-29
CHINA ELECTRONIC TECH GRP CORP NO 38 RES INST
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The technical problem to be solved by the present invention is: how to solve the problem that the single-channel liquid-cooled heat sink is difficult to meet the high-efficiency heat transfer between the heat sink and the liquid, and provide an integrated liquid-cooled chip radiator filled with three-cycle minimal curved surfaces. The radiator makes full use of the characteristics of the high specific surface area of ​​the three-period minimal curved surface, increases the surface contact area between the liquid-cooled radiator and the coolant and the local mixing speed of the coolant, and improves the heat dissipation performance of the liquid-cooled radiator

Method used

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  • Integrated liquid cooling chip radiator filled with three-period extremely-small curved surface and manufacturing method of integrated liquid cooling chip radiator
  • Integrated liquid cooling chip radiator filled with three-period extremely-small curved surface and manufacturing method of integrated liquid cooling chip radiator
  • Integrated liquid cooling chip radiator filled with three-period extremely-small curved surface and manufacturing method of integrated liquid cooling chip radiator

Examples

Experimental program
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Effect test

Embodiment 1

[0031] Such as figure 1 , 5 As shown, this embodiment provides a technical solution: an integrated liquid-cooled chip radiator filled with a three-period minimal curved surface, including: a liquid inlet joint 1, a liquid outlet joint 4, a liquid cooling chamber 2, and a three-period minimal curved surface unit A cell array 3; the three-period minimal curved surface unit cell array 3 is arranged inside the liquid cooling chamber 2, and is integrally formed with the liquid cooling chamber 2 by using an additive manufacturing method. The liquid outlet joint 4, the Liquid inlet joints 1 are arranged at both ends of the liquid cooling chamber 2 .

[0032] Furthermore, the three-period minimum surface unit cell array includes a plurality of interconnected three-period minimum surface unit cells, and the three-period minimum surface unit cells include three interconnected curved surfaces, respectively P curved surfaces ( Such as figure 2 shown), I-WP surface (such as image 3 s...

Embodiment 2

[0046] In this embodiment, laser selective melting forming technology is used for preparation, which is suitable for the process flow of the present invention such as Image 6 shown. The first step in the production process is data preparation, which mainly refers to the 3D model suitable for 3D printing, the printing parameters matching the product structure, and the division of the printing program. NX software is used to process the 3D model and optimize the structure; the processed The model uses Magics software for data preparation and printing program generation. Import the prepared data into the 3D printer and start the laser forming process, that is, import the printing program into the 3D printer. After the printer recognizes the program, it converts it into a two-dimensional laser scanning path, and uses the laser as the energy source to print point by point, accumulate layer by layer, and print the product . After the part is formed, the excess powder is removed, ...

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Abstract

The invention discloses an integrated liquid cooling chip radiator filled with a three-period extremely-small curved surface and a manufacturing method, and belongs to the technical field of heat dissipation equipment. The integrated liquid cooling chip radiator comprises a liquid inlet connector, a liquid outlet connector, a liquid cooling cavity and a three-period extremely-small curved surface unit cell array; the three-period minimal curved surface unit cell array is arranged in the liquid cooling cavity and is integrally formed with the liquid cooling cavity, and the liquid outlet connector and the liquid inlet connector are arranged at the two ends of the liquid cooling cavity. The large specific surface area of the three-period extremely-small curved surface is used for increasing heat convection between the liquid cooling radiator and the cooling liquid, integrated forming is achieved, thermal contact resistance between different components is eliminated, heat transfer is more uniform and rapid, the liquid cooling radiator is more suitable for radiating of chips with high heating density, and the phenomenon of local hot spots of the chips can be reduced or even completely eliminated.

Description

technical field [0001] The invention relates to the technical field of heat dissipation equipment, in particular to an integrated liquid-cooled chip radiator and a manufacturing method filled with three-period minimally curved surfaces. Background technique [0002] With the development of electronic technology, the units and core modules in electronic equipment are developing in the direction of miniaturization, but the packaging density is getting higher and higher, and the integration of electronic equipment is getting higher and higher. The heat flux density per unit area of ​​core devices The sharp increase puts forward higher requirements on the heat dissipation capacity of the liquid cooling plate. The local heat flux density will cause heat to accumulate locally, and generate local high temperature on the surface of the chip or module, which will affect the performance and reliability of the chip and shorten the working life of the chip. [0003] The heat dissipatio...

Claims

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Application Information

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IPC IPC(8): H01L23/473H01L21/48
CPCH01L23/473H01L21/4871
Inventor 陈兴玉吴书豪周金文盛文军张燕龙查珊珊田富君
Owner CHINA ELECTRONIC TECH GRP CORP NO 38 RES INST
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