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Method for etching two-step pattern of thick copper-coated ceramic substrate

A technology for ceramic substrates and graphics, which is applied in chemical/electrolytic methods to remove conductive materials, manufacture electrical components, and printed circuits. It can solve problems such as complex etching processes and alignment errors, and achieve the effect of simple methods.

Pending Publication Date: 2022-04-01
WUXI TIANYANG ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The object of the present invention is to provide a method for etching a two-step pattern on a thick copper-coated ceramic substrate, so as to solve the problems of the two-time patterned etching process proposed in the background art, which are complicated and have errors in alignment

Method used

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  • Method for etching two-step pattern of thick copper-coated ceramic substrate
  • Method for etching two-step pattern of thick copper-coated ceramic substrate
  • Method for etching two-step pattern of thick copper-coated ceramic substrate

Examples

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Embodiment 1

[0021] Embodiment 1, see Figure 1-3 , the present invention provides a technical solution: a method for etching a two-step pattern on a thick copper-coated ceramic substrate, comprising the following steps;

[0022] Step (1), exposing and developing the photosensitive film;

[0023] Step (2), position the screen printing acid and alkali resistant electroplating protective glue on the graphics surface, and dry it naturally for 6 hours at room temperature;

[0024] Step (3), cleaning and drying after etching depth 0.6mm;

[0025] Step (4), the product is placed in an organic solvent to remove the protective glue and cleaned, and the organic solvent is gasoline;

[0026] Step (5), etch 0.6mm again and remove the film to complete the pattern.

Embodiment 2

[0027] Example 2, see Figure 1-3 , the present invention provides a technical solution: a method for etching a two-step pattern on a thick copper-coated ceramic substrate, comprising the following steps;

[0028] Step (1), exposing and developing the photosensitive film;

[0029] Step (2), position the screen printing acid and alkali resistant electroplating protective glue on the graphic surface, and dry it naturally for 7 hours at room temperature;

[0030] Step (3), cleaning and drying after etching depth 0.6mm;

[0031] Step (4), the product is placed in an organic solvent to remove the protective glue and cleaned, and the organic solvent is acetone;

[0032] Step (5), etch 0.6mm again and remove the film to complete the pattern.

Embodiment 3

[0033] Example 3, see Figure 1-3 , the present invention provides a technical solution: a method for etching a two-step pattern on a thick copper-coated ceramic substrate, comprising the following steps;

[0034] Step (1), exposing and developing the photosensitive film;

[0035] Step (2), position the screen printing acid and alkali resistant electroplating protective glue on the graphic surface, and dry it naturally for 8 hours at room temperature;

[0036] Step (3), cleaning and drying after etching depth 0.6mm;

[0037] Step (4), the product is placed in an organic solvent to remove the protective glue and cleaned, and the organic solvent is xylene;

[0038] Step (5), etch 0.6mm again and remove the film to complete the pattern.

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Abstract

The invention relates to the technical field of semiconductors, and discloses a method for etching a two-step pattern of a thick copper-coated ceramic substrate. Step (1), pasting a photosensitive film, exposing and developing; (2) acid and alkali resistant electroplating protection glue is positioned on the pattern surface in a silk-screen mode, and drying is conducted; (3) cleaning and drying after the etching depth is 0.6 mm; (4) putting the product into an organic solvent to remove the protective glue and cleaning; and step (5), after 0.6 mm of etching is carried out again, demolding is carried out, and the pattern is completed. The method is simple, positioning silk-screen does not need too high precision, the precision of the whole pattern depends on the precision of the photosensitive mask, and no secondary alignment error exists; only once film pasting exposure development is needed, secondary exposure is not needed, and mark point positioning is not needed.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to a method for etching a two-step pattern on a thick copper ceramic substrate. Background technique [0002] With the development of electronic technology, new requirements are constantly put forward for the miniaturization of semiconductor power devices. Today, the development and application of the three-and-a-half-generation chip provides a solution for the increase in power density and miniaturization of semiconductor power devices. At the same time, for the chip carrier in the semiconductor power module-the copper-clad ceramic substrate, the thickness of the copper clad is getting thicker and thicker. Meet increasing current requirements. At the same time, the graphics on thick copper are becoming more and more complex, some of which are still two-step graphics, which cannot be produced by ordinary exposure, development and etching. [0003] The conventional two-step ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/00H05K3/02H05K3/06
Inventor 王晓刚郑彬朱伟赵蓓莉
Owner WUXI TIANYANG ELECTRONICS
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