High-precision machining device based on multilayer circuit manufacturing

Abstract

A high-precision machining device based on multilayer circuit manufacturing comprises a machining table and a five-axis movement system arranged on the machining table, an adsorption device corresponding to the five-axis movement system is arranged on the machining table, and a micropore printing needle is arranged on the five-axis movement system. A visual observation and alignment system, a multilayer circuit vertical interconnection mechanism, a height measurement and automatic following system and a slit coating mechanism which correspond to the micropore printing needle head are arranged on the five-axis movement system; a fluid control system is arranged in the five-axis movement system, and the fluid control system is communicated with the micropore printing needle head; compared with the prior art, the precise electronic circuit is prepared by utilizing the ultrahigh-precision five-axis motion system, combining the micropore printing nozzle and the high-precision fluid control system, and the visual observation and alignment system is adopted to perform real-time observation and visual alignment on the printing process, so that the printing process is ensured to have better stability.

Description

technical field [0001] The invention relates to the technical field of multilayer circuit fabrication, in particular to a high-precision processing device based on multilayer circuit fabrication. Background technique [0002] The production of multi-layer circuits is generally done through the addition of inkjet or aerosol jetting, the collaboration of nano-silver conductive ink and insulating ink, dispensing technology, thin film technology, thick film technology and organic laminate technology, photolithography + development + chemical / electroplating , vapor deposition or screen printing and other methods; hole forming by mechanical punching / drilling, laser drilling, chemical etching, plasma etching, etc.; hole metallization by chemical / electroplating, screen printing, etc.; through Multi-layer stacking is carried out by vapor deposition, spin coating, stacked co-firing, and lamination. [0003] The traditional process has the problems of large line width and poor preci...

AI Technical Summary

Problems solved by technology

[0006] The printing method disclosed above adopts the floating printing method. Although it can meet the printing of complex multi-layer circuit structures, it is difficult to control the printing accuracy, and there are certain positioning and calibration problems.

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