Method for measuring thickness of die bonding glue of integrated circuit
An integrated circuit and thickness measurement technology, applied in the direction of measuring devices, instruments, optical devices, etc., can solve the problems of long test period and difficulty in meeting test requirements, reduce equipment investment, reduce professional and training costs, and improve collection efficiency effect
Pending Publication Date: 2022-04-05
深圳电通纬创微电子股份有限公司
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Problems solved by technology
The above method has high requirements on the test process and equipment, and the test period is long, so it is difficult for general enterprises to meet the test requirements.
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[0030] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
[0031] see Figure 1-4 , a method for measuring the thickness of an integrated circuit crystal-bonding glue, comprising the following steps:
[0032] S1: Using a laser uncapping machine, the laser removes the plastic package 1 at the bottom of the integrated circuit and leaks out the base island 4;
[0033] S2: Use a tool to remove the base island 4 at the bottom of the integrated circuit, and leak the die-bonding glue 3;
[0034] Use a heat gun to blow air ...
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The invention relates to the field of die bonding glue thickness measurement, and discloses an integrated circuit die bonding glue thickness measurement method comprising the following steps: S1, using a laser uncapping machine, removing a plastic package body at the bottom of an integrated circuit through laser, and exposing a base island; s2, removing the base island at the bottom of the integrated circuit by using a tool, and exposing the solid crystal glue; and taking out the die bonding glue at the bottom of the chip by a tool. In the existing finished product integrated circuit test analysis, a general method for measuring the thickness of the solid crystal glue comprises the steps of cutting, grinding and polishing the integrated circuit to form a mirror surface, and observing and directly measuring the tangent plane of the integrated circuit under a 1000-times microscope, and the scheme can be used for rapidly and massively measuring the thickness of the solid crystal glue by comparing with the method. The problem of production line failure caused by the thickness of the solid crystal glue is checked, and the operation is more convenient and quicker.
Description
technical field [0001] The invention relates to the field of measuring the thickness of crystal-bonding glue, in particular to a method for measuring the thickness of crystal-bonding glue for integrated circuits. Background technique [0002] During the packaging process of integrated circuits, the die-bonding process uses die-bonding glue to bond the chip to the base island of the lead frame. Die-bonding glue can strongly fix the chip, and the bonding process can perform ultrasonic bonding on this basis. In the above process, the thickness of the die-bonding glue plays an important role. On the one hand, it has a direct impact on the electrical performance and heat dissipation performance of the integrated circuit; on the other hand, it has a huge impact on the layering and subsequent reliability of the integrated circuit during use. [0003] In the test and analysis of finished integrated circuits, the general method for measuring the thickness of the die-bonding adhesiv...
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IPC IPC(8): G01B11/06
Inventor 伍江涛叱晓鹏
Owner 深圳电通纬创微电子股份有限公司