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Air pressure control and monitoring system and method for photoetching machine and photoetching machine

A technology of air pressure control and monitoring system, which is applied in the field of lithography machines, and can solve the problems of reducing lithography yield and reducing optical transmittance

Active Publication Date: 2022-04-05
INST OF MICROELECTRONICS CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The optical system of deep ultraviolet lithography and ultraviolet lithography will also be affected by polluting gases and particles, thereby reducing the optical transmittance and lowering the yield of lithography. Strict control of polluting gases and particles

Method used

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  • Air pressure control and monitoring system and method for photoetching machine and photoetching machine
  • Air pressure control and monitoring system and method for photoetching machine and photoetching machine

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Embodiment Construction

[0033] Exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. Although exemplary embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure may be embodied in various forms and should not be limited by the embodiments set forth herein. Rather, these embodiments are provided for more thorough understanding of the present disclosure and to fully convey the scope of the present disclosure to those skilled in the art.

[0034] It should be understood that the terminology used herein is for the purpose of describing particular example embodiments only and is not intended to be limiting. As used herein, the singular forms "a", "an" and "the" may also be meant to include the plural forms unless the context clearly dictates otherwise. The terms "comprising", "comprising", "containing" and "having" are inclusive and thus indicate the presence of stated...

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Abstract

The invention belongs to the technical field of photoetching machines, and particularly relates to a photoetching machine and an air pressure control and monitoring system and method thereof, and the air pressure control and monitoring system of the photoetching machine comprises a full-scale vacuum gauge assembly, a film vacuum gauge assembly and a vacuum pump set. The full-range vacuum gauge assembly comprises full-range vacuum gauges which are respectively arranged in the main chamber, the silicon wafer stage chamber, the silicon wafer transmission chamber and the mask transmission chamber; the thin film vacuum gauge assembly comprises thin film vacuum gauges which are respectively arranged in the main chamber, the illumination optical chamber, the projection optical chamber, the silicon wafer stage chamber, the silicon wafer transmission chamber and the mask transmission chamber; the vacuum pump set comprises a main chamber vacuum pump, a silicon wafer stage chamber vacuum pump, a silicon wafer transmission chamber vacuum pump and a mask transmission chamber vacuum pump. According to the air pressure control and monitoring system for the photoetching machine, the whole working process of the photoetching machine can be monitored in real time, and the process air pressure of each chamber can be accurately measured in the process operation period.

Description

technical field [0001] The invention belongs to the technical field of lithography machines, and in particular relates to a lithography machine air pressure control and monitoring system and method, and a lithography machine. Background technique [0002] This section provides background information related to the present disclosure only and is not necessarily prior art. [0003] Extreme ultraviolet (EUV) lithography is the mainstream lithography technology for 7nm and below nodes. Extreme ultraviolet light with a wavelength of 13.5nm is strongly absorbed by all substances including air, so it must be placed in a vacuum environment. Solid materials can dissolve and adsorb some gases in an atmospheric environment, but when placed in a vacuum environment, they will degas due to processes such as desorption. For extreme ultraviolet lithography machines, hydrocarbons and water vapor released from materials will form carbon deposits or produce oxidation on the surface of extrem...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/20
CPCY02P70/50
Inventor 王魁波吴晓斌罗艳谢婉露沙鹏飞李慧韩晓泉
Owner INST OF MICROELECTRONICS CHINESE ACAD OF SCI