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High-density common pin reinforced frame

A high-density, enhanced technology, used in electrical components, electrical solid-state devices, circuits, etc., can solve problems such as narrow side width, low density, and inability to share, and achieve high productivity, guaranteed strength, and wide applicability.

Pending Publication Date: 2022-04-05
福建福顺半导体制造有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The invention provides a high-density shared pin-reinforced frame, which solves the problems of low density, narrow sides and wide pins of the old frame, and the number of pins needs to be in one-to-one correspondence with the plastic sealing mold and cannot be shared.

Method used

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  • High-density common pin reinforced frame
  • High-density common pin reinforced frame
  • High-density common pin reinforced frame

Examples

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no. 1 example

[0037] Please refer to figure 1 , figure 2 , image 3 , Figure 4 , Figure 5 , Figure 6 , Figure 7 , Figure 8 , Figure 9 , Figure 10 , Figure 11 and Figure 12 ,in, figure 1 It is a structural schematic diagram of the existing 4R framework; figure 2 for figure 1 Schematic diagram of the five-pin structure of the frame shown; image 3 It is a structural schematic diagram of the existing 4R framework; Figure 4 for image 3 Schematic diagram of the six-pin configuration of the frame shown Figure 5 A structural schematic diagram of the first embodiment of the high-density shared pin-reinforced frame provided by the present invention; Figure 6 for Figure 5 The structural schematic diagram of the first plastic seal part shown; Figure 7 for Figure 6 The schematic diagram of the structure of the first plastic cavity shown; Figure 8 for Figure 6 The schematic diagram of the structure between the two groups of first plastic sealing cavities shown; ...

no. 2 example

[0048] see figure 2 , image 3 , Figure 4 , Figure 6 and Figure 7 , based on the high-density shared pin-reinforced frame provided in the first embodiment of the present application, the second embodiment of the present application proposes another high-density shared pin-reinforced frame. The second embodiment is only a preferred mode of the first embodiment, and the implementation of the second embodiment will not affect the independent implementation of the first embodiment.

[0049] Specifically, the difference between the high-density shared pin-reinforced frame provided in the second embodiment of the present application is that the high-density shared pin-reinforced frame needs to be stored in a dedicated storage device after molding The storage device includes a storage rack 3 and a frame body 4, both sides of the inner wall of the storage rack 3 are provided with limiting chute 31; a connecting frame 5, the surface of the connecting frame 5 is slidably connect...

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PUM

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Abstract

The invention provides a high-density common pin reinforced frame. The high-density common pin reinforced frame comprises a first frame body and a second frame body, the first frame body is provided with at least two hundred and sixteen groups of first plastic sealing strips, each first plastic sealing strip is provided with at least three groups of first plastic sealing cavities, the inner sides of the first plastic sealing cavities are fixedly connected with artificial pins, and the outer sides of the artificial pins are fixedly connected with the second frame body. And at least two to sixteen groups of second plastic sealing strips are arranged on the second frame body. The high-density common pin reinforced frame provided by the invention is provided with 18 rows of frames, the product density is higher, the number of products in each strip is up to 1296, more frame metal materials are saved, and the yield is higher; the problem that different plastic packaging molds need to be used for different pins 5 and 6 can be solved at the same time by adopting a pair of plastic packaging molds with six pin tooth-shaped inserts, and two different pin products can be compatible by adopting one set of mold, so that the applicability is wider; and the reinforcing crochet hooks are adopted in the second frame body, so that the strength of product pins is greatly guaranteed.

Description

technical field [0001] The invention relates to the technical field of frame structures, in particular to a high-density shared pin-reinforced frame. Background technique [0002] As the chip carrier of the integrated circuit, the lead frame is a key structural part that realizes the electrical connection between the lead-out end of the chip's internal circuit and the external lead by means of a bonding material, forming an electrical circuit. It acts as a bridge connecting the external wire. Most of the semiconductor integrated blocks need to use lead frames, which are important basic materials in the electronic information industry. [0003] Such as figure 1 , figure 2 , image 3 and Figure 4 They are the existing five-pin and six-pin strip structure and unit structure respectively. The existing domestically produced sot353 frame still adopts the old low-density, narrow side and wide width. The number of pins needs to be in one-to-one correspondence with the plastic ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/495
Inventor 陈力
Owner 福建福顺半导体制造有限公司