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Avalanche photodiode and manufacturing method thereof

An avalanche photoelectric and diode technology, applied in circuits, electrical components, semiconductor devices, etc., can solve the problems of thickening of avalanche photodiodes and poor performance of avalanche photodiodes, and achieve the effect of improving performance

Pending Publication Date: 2022-04-12
SHANGHAI INTEGRATED CIRCUIT RES & DEV CENT +1
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the depletion region of the avalanche photodiode is difficult to further thicken, and the performance of the avalanche photodiode is poor

Method used

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  • Avalanche photodiode and manufacturing method thereof
  • Avalanche photodiode and manufacturing method thereof
  • Avalanche photodiode and manufacturing method thereof

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Embodiment Construction

[0049] In order to improve the performance of the avalanche photodiode, an embodiment of the present application provides an avalanche photodiode, by setting a plurality of first diffusion regions at intervals on the first surface of the substrate, and the conductivity type of the first diffusion region is different from that of the substrate , so that the first diffusion region and the substrate between adjacent first diffusion regions form a PN junction. The PN junction is a lateral PN junction. By adjusting the depth of the first diffusion region and the distance between adjacent first diffusion regions, the length and thickness of the depletion region of the PN junction can be adjusted to increase the size of the depletion region, thereby improving Performance of avalanche photodiodes. In addition, each first diffusion region forms a PN junction with its adjacent substrate, the number of avalanche photodiodes in the embodiment of the present application is at least two, an...

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Abstract

The invention provides an avalanche photodiode and a manufacturing method thereof, relates to the technical field of semiconductors, and is used for solving the technical problem that the avalanche photodiode is poor in performance. The avalanche photodiode includes: a substrate; the first diffusion regions are arranged on the first surface of the substrate at intervals, the first diffusion regions are electrically connected with the first electrode, the conduction types of the first diffusion regions and the substrate are different, and PN junctions are formed by the first diffusion regions and the substrate located between the adjacent first diffusion regions; the first heavily doped region is arranged on the second surface of the substrate, the second surface and the first surface are oppositely arranged, the first heavily doped region is located among the multiple first diffusion regions, the conduction type of the first heavily doped region is the same as that of the substrate, and the first heavily doped region is electrically connected with the second electrode. The length and the thickness of the PN junction depletion region can be adjusted by adjusting the depth of the first diffusion regions and the distance between the adjacent first diffusion regions, so that the size of the depletion region is increased, and the performance of the avalanche photodiode is further improved.

Description

technical field [0001] The present application relates to the technical field of semiconductors, in particular to an avalanche photodiode and a manufacturing method thereof. Background technique [0002] With the development of technologies and markets such as the Internet of Things, Internet of Vehicles, and autonomous driving, avalanche optoelectronic devices, especially avalanche photodiodes, such as Single Photon Avalanche Diodes (Single Photon Avalanche Diode, SPAD for short), due to their small size, high sensitivity, The advantages of fast response have gradually become the focus of research. [0003] Avalanche photodiodes generally include a PN junction, and the contacting regions of the PN junction form a depletion region. After a reverse bias is applied to the PN junction, the incident light is absorbed by the depletion region to excite electron-hole pairs, and the electron-hole pairs collide with the lattice atoms under the action of an external electric field to...

Claims

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Application Information

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IPC IPC(8): H01L31/107H01L31/0352H01L31/0216H01L31/18
Inventor 康晓旭张南平
Owner SHANGHAI INTEGRATED CIRCUIT RES & DEV CENT
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