Conductive heating device for eliminating conductive heating deformation of ultrathin metal plate

Abstract

The invention discloses a conductive heating device for eliminating conductive heating deformation of an ultra-thin metal plate, which can controllably heat the ultra-thin metal plate with the thickness of 0.03-0.15 mm at a heating rate of 10-1500 DEG C / s, and comprises a base and two clamping electrode mechanisms arranged on the base. A clamping area for placing the ultrathin metal plate is arranged between the two electrode clamping mechanisms, and the ultrathin metal plate comprises a main body part and clamped ends which are respectively positioned at two ends of the main body part along the length direction of the ultrathin metal plate. The width of the clamped end is larger than that of the main body part, and the width of the main body part is constant in the length direction. The electrode clamping mechanism comprises an insulating bakelite clamp and an electrode arranged at the clamping end of the insulating bakelite clamp. The other end, away from the clamping end, of the insulating bakelite clamp is provided with a clamping system used for controlling clamping and releasing of the clamping end, and at least one of the two electrode clamping mechanisms can move in the length direction of the ultrathin metal plate.

Description

technical field [0001] The disclosure relates to the technical field of metal heat treatment, in particular to a conductive heating device for eliminating the deformation of an ultra-thin metal plate by conductive heating. Background technique [0002] At present, in order to achieve the purpose of rapid heating of metals, many materials and materials simulation equipment such as thermal simulation test machines usually adopt the method of direct electrode conduction heating, and use the heating transformer to provide a certain voltage to the sample, so that a large current passes through the test, and use the sample itself Resistance achieves heating purpose. [0003] However, due to its ultra-thin characteristics, the critical compressive stress of the ultra-thin stainless steel plate is much smaller than that of the thick plate, and it is more prone to compression instability, resulting in failure and damage of the sample, which is difficult to meet the simulation require...

AI Technical Summary

Problems solved by technology

[0003] However, due to its ultra-thin characteristics, the critical compressive stress of the ultra-thin stainless steel plate is much smaller than that of the thick plate, and it is more prone to compression instability, resulting in failure and damage of the sample, which is difficult to meet the simulation requirements.

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