Dividing device and dividing method
A technology of processed objects and expansion sheets, applied in chemical instruments and methods, cleaning methods and utensils, cleaning methods using liquids, etc., can solve problems such as adhesion, device quality degradation, obstacles, etc., and achieve the effect of preventing obstacles
Pending Publication Date: 2022-04-15
DISCO CORP
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Problems solved by technology
[0005] However, when the divided chips that fell into the chip receiving mechanism fly while expanding, there is a concern that they may adhere to the front surface of the workpiece
[0006] Especially when the workpiece is a semiconductor device wafer, the quality of the device may be degraded or the bonding and packaging may be hindered due to the adherence of dicing chips to the device.
[0007] In addition, in MEMS (Micro Electro Mechanical Systems, micro-electromechanical systems) devices that cannot be cleaned after the workpiece is divided, the adhesion of divided chips has become a major problem
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[0026] Hereinafter, embodiments of the present invention will be described with reference to the drawings.
[0027] The formation of the object to be processed and the origin of division in the division device of the present invention will be described. figure 1 (A) is a perspective view schematically showing a structural example of the workpiece 11 to be divided in the present embodiment. Such as figure 1 As shown in (A), the workpiece 11 is, for example, a disk-shaped wafer formed of a material such as silicon, silicon carbide, or sapphire.
[0028] The front surface 11a side of the workpiece 11 is divided into a plurality of regions by planned dividing lines (separation lanes) 13 set in a grid pattern, and IC (Integrated Circuit, integrated circuit), MEMS (Micro Electro Mechanical Systems, microelectromechanical systems) are formed in each area. system), LED (Light Emitting Diode, light emitting diode) and other devices 15 .
[0029] In addition, in this embodiment, a di...
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The invention provides a dividing apparatus and a dividing method. The invention provides a novel technology for solving the problem that cutting chips adhere to a processed object. A dividing device (12) for dividing a workpiece (11) along a division start point by expanding an expansion sheet of a workpiece unit (10) obtained by attaching the workpiece (11) having the division start point to the expansion sheet (31) and attaching the expansion sheet to a frame (33), the dividing device (12) comprising: an expansion unit (22) for expanding the expansion sheet (31) and dividing the workpiece (11) along the division start point; a cutting unit that holds the frame of the workpiece unit by means of the holding mechanism in a state in which the workpiece faces downward, and that cuts the workpiece along the cutting start point by expanding the expansion sheet; and a chip receiving mechanism (60) having: a chip receiving surface (62a) that faces the workpiece of the workpiece unit including the frame held by the holding mechanism, and that receives divided chips (70) generated by the division of the workpiece; and a cleaning liquid supply unit (64) that supplies a cleaning liquid (66) toward the chip receiving surface.
Description
technical field [0001] The present invention relates to a dividing device that divides the workpiece along the starting point of division by expanding an expanding sheet of a workpiece unit formed by pasting a workpiece having a dividing starting point on the expanding sheet. Background technique [0002] Conventionally, for example, as disclosed in Patent Document 1, there is known a dividing device that expands the expanded sheet of the processed object unit obtained by pasting the processed object formed with the starting point of division on the expanded sheet. The workpiece is divided along the division starting point. [0003] In addition, Patent Document 1 discloses a configuration in which split chips are expanded with the workpiece facing down in order to prevent the split chips from adhering to the front surface of the workpiece. The split chips generated during splitting fall into the scrap receiving mechanism of the dust collector located further below and are c...
Claims
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IPC IPC(8): B23K26/38B23K26/70B23K26/146B23K26/16H01L21/304
CPCH01L21/67132H01L21/67092H01L21/78H01L21/6836H01L21/67051H01L21/02076B08B3/02H01L2221/68336
Inventor 赵金艳
Owner DISCO CORP