Multi-chip normally-mounted reset wafer level packaging structure and method

Abstract

The invention discloses a multi-chip normally-mounted reset wafer-level packaging structure and method, and the method comprises the following steps: carrying out the reset layout of multiple chips, placing different types of chips 1 on a substrate 12 on which a temporary bonding film 11 is pasted through employing a paster technology, enabling the front surfaces of the chips to be upward, and enabling the back surfaces of the chips to be pasted on the temporary bonding film on the substrate; the front surface of the chip comprises electrodes and key functional areas; manufacturing a first insulating layer, namely manufacturing the first insulating layer 15 on the chip surface of the substrate 12 by utilizing coating, spraying and laminating processes, and performing patterning treatment by utilizing processes such as photoetching and the like to expose part of electrodes and all key functional areas of the chip; and finally, after the rewiring process is completed, the main packaging process is completed, and then the chips are cut into single chips according to the size of each group of chips for subsequent PCB welding. The multi-chip packaging technology belongs to one-time packaging of the multiple chips, the packaging process of the multiple chips is simplified, and the packaging efficiency is improved.

Description

technical field [0001] The invention belongs to the field of semiconductors, and in particular relates to the chip reset and multi-chip packaging technology of filter wafers, and relates to a filter wafer-level packaging structure and method. Background technique [0002] The current packaging process uses flip-chip coating to form a cavity, which has certain requirements for the chip gap. The flip-chip substrate also needs to preset corresponding graphics, and the process is complicated. The patent application number is 201621225249.3, which discloses a thin-film bulk acoustic wave device. The multi-chip module packaging structure including the bare chip includes a substrate and a bare chip. The bare chip includes a thin film bulk acoustic wave device bare chip and other functional bare chips. Corresponding electrodes are provided on the substrate and all the bare chips, and it is characterized in that : All bare chip electrodes are correspondingly connected by gold balls a...

AI Technical Summary

Problems solved by technology

[0003]The above patents have the following disadvantages. First, the anti-overflow components are preset on the packaging substrate, resulting in a large chip pitch and a large overall packaging volume; In the groove of the substrate, the surface of the chip cannot be protected, and the process of placing the chip in the groove is difficult

Images