Flexible circuit board film-covering type supplementary material pasting and pressing method
A flexible circuit board, flexible circuit board technology, applied in the direction of printed circuit, printed circuit manufacturing, electrical components, etc., can solve the problems of increased cost, low output efficiency, waste of consumables, etc., to achieve saving consumables and high output efficiency of finished products , the effect of reducing the number of rapid pressing
Pending Publication Date: 2022-04-15
昆山圆裕电子科技有限公司
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Problems solved by technology
The overall lamination process includes film lamination, punching, pickling and brushing, chemical nickel gold, pre-lamination of supplementary materials, fast pressing of supplementary materials, and ink printing. It needs to be transferred twice across stations, and the lamination of the pre-lamination machine is completed twice. Finished products, the process is time-consuming to turn back and forth; because the PI film material is a strip structure with a thickness of 1mil, it takes 18 hours for the staff to manually align and fit a batch of products, and the output efficiency is low; supplementary materials need to be outsourced to CNC processing, and the cost Increase; every additional pressing of the pre-mounting machine wastes 200PNL of consumables
Method used
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Embodiment
[0020] refer to Figure 1-2 As shown, this embodiment is a film-coated replenishment method for a flexible circuit board, which includes the following steps:
[0021] 1) Provide a flexible circuit board 1 and a coating layer 2, wherein the coating layer 2 is made of polyimide material, and pre-laminate the coating layer 2 and the flexible circuit board 1 for use;
[0022] 2) PI film 3 is provided as a supplementary material, and the outer periphery of PI film 3 is cut to match the coating layer 2;
[0023] 3) The PI film 3 is laser cut into a PNL structure, and the PI film 3 has a plurality of grid holes 31 evenly spaced at equal intervals;
[0024] 4) The supplementary material is pre-attached to the coating layer 2 to complete the PNL one-time finished product structure;
[0025] 5) Transfer the flexible circuit board 1 pre-attached with the supplementary material and the film layer 2 to the pre-attachment machine, and perform one-time lamination to complete the lamination...
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The invention discloses a flexible circuit board film-covering type supplementary material pasting and pressing method which comprises the following steps: providing a flexible circuit board and a film-covering layer, and aligning and pre-pasting the film-covering layer and the flexible circuit board for later use; a PI film is provided as a supplementary material, and the cut periphery of the PI film is matched with the film covering layer; the PI film is cut into a PNL structure through laser, and the PI film is provided with a plurality of grid holes which are uniformly distributed at equal intervals; the supplementary material is pre-pasted to the film covering layer to complete a PNL primary finished product structure; and transferring the flexible circuit board to which the repairing material and the film coating layer are pre-pasted to a pre-pasting machine, and performing primary pressing to complete pasting and pressing operation. According to the method, the repair material turnover process is reduced, the laminating time is shortened, the laminating frequency is reduced, and the cost is saved.
Description
technical field [0001] The invention belongs to the technical field of flexible circuit board manufacturing, and in particular relates to a method for pasting and pressing flexible circuit boards with film-coated supplementary materials. Background technique [0002] The existing flexible circuit board is attached with a film layer, and the film layer is again attached with supplementary materials for special product structures. The supplementary material is PI film material, and the PI film needs to be cut to make it suitable for a single PNL product. The PI film is passed through a CNC knife. Molded into several single strips. The overall lamination process includes film lamination, punching, pickling and brushing, chemical nickel gold, pre-lamination of supplementary materials, fast pressing of supplementary materials, and ink printing. It needs to be transferred twice across stations, and the lamination of the pre-lamination machine is completed twice. Finished products...
Claims
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IPC IPC(8): H05K3/00
Inventor 付晓红
Owner 昆山圆裕电子科技有限公司