Computer mainboard with integrated heat dissipation function

Abstract

The invention relates to the technical field of computer mainboards, and discloses an integrated heat dissipation computer mainboard which comprises a mainboard case and a mainboard body arranged in the mainboard case, a heat dissipation mechanism is arranged in the mainboard case, and the heat dissipation mechanism comprises a centralized heat dissipation device and a mainboard heat dissipation device. The mainboard heat dissipation device comprises a mainboard heat dissipation air channel and a water-cooling auxiliary heat dissipation assembly, the mainboard heat dissipation device has two stages of heat dissipation modes, the first stage of heat dissipation mode is a low-power mode, and the mainboard heat dissipation device operates at low power. Air blown in by the two dust removal air inlet assemblies is gathered through the air collection cover, then air exhaust holes formed in the air collection cover are guided into the main board case, heat dissipation is conducted on the whole interior of the main board case, the heat dissipation condition is that the main board body is conducted under the condition that a high-temperature alarm is not given out, and when the main board body gives an over-high-temperature alarm in the using process, the main board body is not heated. And the heat dissipation mechanism adopts a second-stage heat dissipation mode to dissipate heat of the mainboard body, so that the mainboard body can dissipate heat at the fastest speed.

Description

technical field [0001] The invention relates to the technical field of computer motherboards, in particular to a computer motherboard with integrated heat dissipation. Background technique [0002] Motherboard, also known as mainboard, system board or motherboard; it is installed in the chassis and is one of the most basic and important components of a microcomputer. The motherboard is generally a rectangular circuit board, on which are installed the main circuit systems that make up the computer. Generally, there are BIOS chips, I / O control chips, keyboard and panel control switch interfaces, indicator light connectors, expansion slots, motherboards and cards. DC power supply connectors and other components. [0003] At present, due to the increasingly powerful computing functions, the temperature of the computer motherboard is higher, especially in some special environments, such as poor air flow and high ambient temperature, which require real-time heat dissipation and c...

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Problems solved by technology

[0003] At present, due to the increasingly powerful computing functions, the temperature of the computer motherboard is higher, especially in some special environments, such as poor air flow and high ambient temperature, which require real-time heat dissipation and cooling processing. The heat dissipation effect of the current computer mainframe chassis Not ideal, most of them use air cooling to dissipate heat. This cooling method may cause a large amount of heat to accumulate inside the mainframe chassis. Although some mainframe chassis use water cooling for heat dissipation, the water cooling method is through the inside of the chassis. Using water pipes, the water flows through the pipes in the chassis to take away part of the temperature in the chassis. Although this method can achieve a cooling effect, when the surrounding environment is high, the temperature of the water flow also increases, which reduces the cooling effect; In the prior art, there is no device that can flexibly switch between air cooling and water heating, and adopt different levels of heat dissipation capacity for different heat levels to dissipate heat

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