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Resin composition and resin molded article thereof

A technology of resin composition and resin molded body, applied in the direction of nickel compounds, instruments, optical components, etc., can solve the problems of unstable supply, high production cost, large temperature lag, etc., and achieve the effect of suppressing functional deterioration

Pending Publication Date: 2022-04-29
TOKYO INST OF TECH +2
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, there are problems in that an expensive element is used as the metal element M, making the production cost high, and the metal element M is a rare element, making its supply unstable
In addition, these materials have the problem of large temperature hysteresis

Method used

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  • Resin composition and resin molded article thereof
  • Resin composition and resin molded article thereof
  • Resin composition and resin molded article thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0119] 0.135 g of crushed pellets of optical polycarbonate C-1 as a thermoplastic resin were dissolved at 50° C. using 2 ml of tetrahydrofuran as a solvent. To this solution was added 0.368 g of negative thermally expandable metal oxide particles A-2 having a protective layer formed of epoxy functional group-containing protective layer forming material B-1, and the mixture was stirred with a stirrer for 10 minutes and then sonicated. 5 minutes. The solvent was evaporated by raising the temperature to boiling point while stirring with a stirrer, vacuum-dried at 120° C., cooled to room temperature, and then pulverized with an agate mortar for 10 minutes to obtain a resin composition.

[0120] A 6 mm square through hole was opened in the center of the cylinder, and a stamper sealable with a mirror sheet from the upper and lower surfaces of the through hole was prepared. The through-hole portion of the stamper was filled with the obtained resin composition, and its upper and ...

Embodiment 2

[0123] A resin composition and a molded body were prepared under the same conditions as in Example 1 except that the protective layer forming material B of Example 1 was changed from B-1 to B-2, and the coefficient of linear expansion was measured.

Embodiment 3

[0125] A resin composition and a molded body were prepared under the same conditions as in Example 1 except that the protective layer forming material B of Example 1 was changed from B-1 to B-3, and the coefficient of linear expansion was measured.

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Abstract

The purpose of the present invention is to obtain a resin composition having low thermal expansion properties by adding a negative thermal expansion material to a thermoplastic resin and by suppressing functional deterioration of the negative thermal expansion properties at the time of hot working. The present invention provides a resin composition including metal oxide particles having negative thermal expansion properties and a thermoplastic resin. The negative thermal expansion of the particles is attributable to crystal phase transition driven by electron transfer between constituent metals, and a covalent protective layer that suppresses electron transfer is formed between the particles and the thermoplastic resin.

Description

technical field [0001] The present invention relates to a resin composition and its resin molded body. In particular, the present invention relates to a novel resin composition in which a metal oxide having negative thermal expansion properties is added to a thermoplastic resin, and to a low thermal expansion member using a resin molded body thereof. Background technique [0002] Generally, electronic components, optical components, and structural components are made of materials such as metals, resins, ceramics, and glass. These conventional materials have positive linear expansion properties, and thus expand and contract as the ambient temperature rises and falls. In particular, since resin materials show a large volume expansion to external heat, parts using these materials affect the performance of precision equipment. [0003] In order to solve such problems, it is proposed to use metal oxides having negative thermal expansion properties. Metal oxides having negative...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L69/00C08L45/00C08K9/06C08K3/22G02B5/08G02B7/02
CPCC08K9/06C08K3/22G02B7/021G02B5/08C08L69/00C08L45/00G02B7/008G02B7/028C08K2003/2293C08K2003/2265C01P2002/34C01G53/40C01P2004/62C08K9/08G02B1/04C08L2666/54C01G53/006C01P2006/33G02B7/02
Inventor 东正树酒井雄树小岛贵博
Owner TOKYO INST OF TECH
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