Epoxy resin composition and application thereof, epoxy resin molding material and preparation method and application thereof

Abstract

The invention relates to the field of epoxy resin compositions, and discloses an epoxy resin composition and application thereof, an epoxy resin forming material and a preparation method and application thereof. The composition comprises 13 to 15 wt% of epoxy resin, 5 to 6 wt% of phenolic resin, 70 to 78 wt% of an inorganic filler, 0.5 to 1 wt% of a release agent, 0.5 to 1 wt% of a silane coupling agent and 0.12 to 0.3 wt% of a curing accelerator. The curing agent accelerator comprises a first curing accelerator and optionally a second curing accelerator; the first curing accelerator is 2-phenyl-4-methylimidazole, and the second curing accelerator is selected from 1, 8-diazabicyclo (5, 4, 0) undecylene-7 and / or 2-methylimidazole. The composition comprises a specific type of curing accelerator, so that the epoxy resin product prepared from the composition has high mechanical property, high glass transition temperature and excellent flowability, and the composition has low cost.

Description

technical field [0001] The invention relates to the field of epoxy resin compositions, in particular to an epoxy resin composition and its application, an epoxy resin molding material and its preparation method and application. Background technique [0002] With the development and application of the semiconductor device industry, the packaging and performance requirements for semiconductor packaging materials are also getting higher and higher. Improve manufacturing efficiency and reduce the chance of process defects. From a performance point of view: during the use of semiconductor devices; a higher glass transition temperature (Tg) can meet more working environments with different conditions, effectively prolonging the service life of semiconductor devices. Contents of the invention [0003] The object of the present invention is to provide a kind of epoxy resin composition and its application, epoxy resin molding material and its preparation method and application, t...

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Problems solved by technology

[0003] The object of the present invention is to provide a kind of epoxy resin composition and its application, epoxy resin molding material and its preparation method and application, the epoxy resin composition contains a specific type of curing accelerator, so that the epoxy resin prepared from the epoxy resin composition has high mechanical properties, high glass transition temperature and excellent fluidity, and the composition has low cost